Title:
INSULATION FILM-PROVIDED FLAT CONDUCTIVE PLATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/202363
Kind Code:
A1
Abstract:
This insulation film-provided flat conductive plate (1) comprises a flat conductive plate (10) which is a punched product, and an insulation film (20) at least partially film the flat conductive plate (10). The insulation film (20) is an electrodeposited film. The insulation film (20) contains a polyamide imide resin and a fluorine resin where the contained amount of the fluorine resin with respect to the total contained amount of the polyamide imide resin and the fluorine resin is within the range of 72-95 mass%, and has a relative permittivity of 2.2-2.8 at 25℃ and an average film-thickness within the range of 5-100 μm.
Inventors:
YAMASAKI KAZUHIKO (JP)
SAKO NAGISA (JP)
SAKO NAGISA (JP)
Application Number:
PCT/JP2022/010601
Publication Date:
September 29, 2022
Filing Date:
March 10, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01F5/06; H01B3/00; H01B13/00; H01F27/32
Foreign References:
| JP2018131562A | 2018-08-23 | |||
| JP2005228984A | 2005-08-25 | |||
| JP2011071089A | 2011-04-07 | |||
| JP2019096606A | 2019-06-20 | |||
| JP2019096607A | 2019-06-20 | |||
| JPS57182352A | 1982-11-10 | |||
| JP2021049718A | 2021-04-01 | |||
| JP2005228984A | 2005-08-25 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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