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Patent Searching and Data


Title:
INSULATION PANEL FIXING METHOD AND INSULATION PANEL FIXING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/003836
Kind Code:
A1
Abstract:
A substrate 10 is formed into a waveform in which ridge portions 11 projecting to an inner space 2 side and having substantially flat top faces 12 are alternately arranged with groove portions 13 parallel to the ridge portions 11. A procedure is used to implement a fixing step of affixing an insulation panel 20 to the top faces 12 of the ridge portions 11 with the panel being disposed such that the longitudinal direction thereof is orthogonal to the direction of the ridge portions 11. Before performing the fixing step, a length adjusting step is performed by cutting and removing some of the portion of a foaming resin 22 located on a side end 24 of the insulation panel 20 in the longitudinal direction to adjust the length of the insulation panel so that a cut end 25 of same is disposed on the top face 12 of a ridge portion 11 when the side end in the longitudinal direction protrudes toward the groove portion 13 side.

Inventors:
OKADA, Yoshihiro
YOSHIDA, Kazuki
Application Number:
JP2018/021681
Publication Date:
January 03, 2019
Filing Date:
June 06, 2018
Export Citation:
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Assignee:
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1-61, Shiromi 2-chome Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
International Classes:
E04B1/80; E04B2/56
Foreign References:
JP2007040032A2007-02-15
JP2017106259A2017-06-15
Attorney, Agent or Firm:
KYOMEI IP ATTORNEYS (Tenjin 1st Bldg. 8F, 2-26 Nishinakajima 4-chome Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)
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