Title:
INSULATION RESIN SHEET FOR FORMING FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2015/099451
Kind Code:
A1
Abstract:
The present invention relates to an insulation resin sheet for forming a flexible printed circuit board (FPCB), a method for manufacturing the same, and a flexible printed circuit board comprising the insulation resin sheet, the insulation resin sheet comprising: a polyimide film; an epoxy insulation layer formed on one surface or both surfaces of the polyimide film; and a thermoplastic polyimide layer, which is formed on the epoxy insulation layer, and which has a predetermined surface roughness formed on the surface thereof. The present invention can provide an insulation resin sheet capable of simultaneously implementing good adhesiveness securing, resistance to heat, and a micro-circuit pattern, and a buildup printed circuit board using the same.
Inventors:
RYU EUIDOCK (KR)
KIM INWOOK (KR)
PARK KWANGSEOK (KR)
JUNG SOOIM (KR)
KIM HYUNGKYU (KR)
KIM INWOOK (KR)
PARK KWANGSEOK (KR)
JUNG SOOIM (KR)
KIM HYUNGKYU (KR)
Application Number:
PCT/KR2014/012815
Publication Date:
July 02, 2015
Filing Date:
December 24, 2014
Export Citation:
Assignee:
DOOSAN CORP (KR)
International Classes:
B32B27/08; B32B27/26; H05K1/03
Foreign References:
| JP2006224644A | 2006-08-31 | |||
| JP2003012894A | 2003-01-15 | |||
| KR20130120099A | 2013-11-04 | |||
| KR20110080419A | 2011-07-13 |
Attorney, Agent or Firm:
HANBEOT PATENT & LAW FIRM (KR)
특허법인 한벗 (KR)
특허법인 한벗 (KR)
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