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Patent Searching and Data


Title:
INSULATION SHEET, LAMINATE, AND SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/203266
Kind Code:
A1
Abstract:
The present invention provides: an insulation sheet that includes resin composition layers (14, 24, 34), the relative dielectric constant at a frequency of 1 MHz of one surface side (14X, 24X, 34X) being higher than the relative dielectric constant of the other surface side (14Y, 24Y, 34Y), and a circuit pattern being formed on the one surface side; laminates (10, 20, 30) in which the insulation sheet and metal plates (12, 22, 32) are included in the stated order on metal base plates (16, 26, 36), a circuit pattern being formed on the metal plates; and a substrate in which the insulation sheet and the metal plates are included in the stated order on the metal base plates, the metal plates having a circuit pattern.

Inventors:
ZHANG RUI (JP)
OOWASHI KEIGO (JP)
ASHIBA KOUJI (JP)
KOUMA AKI (JP)
MIZUNO SHOHEI (JP)
Application Number:
JP2019/016454
Publication Date:
October 24, 2019
Filing Date:
April 17, 2019
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B17/56; B32B27/00; C08K3/00; C08K3/28; C08K7/00; C08L63/00; H01B3/40; H01B17/60; H05K1/03
Domestic Patent References:
WO2012172776A12012-12-20
Foreign References:
JPH0424996A1992-01-28
JP2008270678A2008-11-06
JP2008201124A2008-09-04
JPH07232403A1995-09-05
JP2012015557A2012-01-19
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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