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Title:
INSULATION STRUCTURE AND INSULATION STRUCTURE MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/203874
Kind Code:
A1
Abstract:
This insulation structure comprises: a flat substrate; and a reinforcing member which is plate shaped, which includes a plurality of protrusions that protrude toward the substrate, and which is supported by the substrate so that end sections of the protrusions adjoin the substrate. The substrate and the reinforcing member are formed using a composite material.

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Inventors:
SENNYU KATSUYA (JP)
FUKUDA YUJI (JP)
TAKEUCHI YUKIO (JP)
TOMIZAKI HONOKA (JP)
IWAMOTO TOMOYUKI (JP)
Application Number:
PCT/JP2023/006861
Publication Date:
October 26, 2023
Filing Date:
February 24, 2023
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C70/10; B32B5/26; B32B3/28; B32B27/18; F16L59/06
Domestic Patent References:
WO2011031242A12011-03-17
WO2022176810A12022-08-25
Foreign References:
JP2015229276A2015-12-21
JPH08207180A1996-08-13
JP2010249304A2010-11-04
JP2001082681A2001-03-30
JP2008002598A2008-01-10
JP2005275642A2005-10-06
JP2016038168A2016-03-22
JP2010007806A2010-01-14
JP2004009493A2004-01-15
JP2011122610A2011-06-23
JP2013532807A2013-08-19
US20120031957A12012-02-09
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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