Title:
INSULATIVE SHEET, LAMINATE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190863
Kind Code:
A1
Abstract:
An insulative sheet according to the present invention comprises a thermosetting resin and a inorganic filler, wherein: the inorganic filler contains boron nitride aggregates; the content of the boron nitride aggregates is not less than 50 mass% with respect to 100 mass% of the insulative sheet; and when using a differential thermal analysis and thermogravimetry simultaneous measurement device to increase the temperature of the insulative sheet from 50°C to 200°C under a dry nitrogen gas flow and with a temperature increase rate of 10°C/minute, the weight reduction rate is 0.10-1.00%. The present invention makes it possible to provide an insulative sheet in which, while having a high filling ratio of boron nitride aggregates, a reduction in insulative properties is suppressed even when subjected to heat treatment, which has good adhesiveness with a metal plate, and in which circuit separation is suppressed.
Inventors:
KANESHIMA YUKI (JP)
ASHIBA KOUJI (JP)
GOEDA KANON (JP)
NISHIMURA TAKASHI (JP)
ASHIBA KOUJI (JP)
GOEDA KANON (JP)
NISHIMURA TAKASHI (JP)
Application Number:
PCT/JP2023/013169
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; B32B15/08; B32B27/20; C08K3/22; C08K3/38
Domestic Patent References:
| WO2021153683A1 | 2021-08-05 |
Foreign References:
| CN113193220A | 2021-07-30 | |||
| JP2019150997A | 2019-09-12 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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