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Patent Searching and Data


Title:
INSULATIVE SUBSTRATE-LESS HEAT-RADIATION TAPE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/124319
Kind Code:
A1
Abstract:
The present invention relates to an insulative substrate-less heat-radiation tape and a manufacturing method therefor, and more specifically, to an insulative substrate-less heat-radiation tape exhibiting excellent insulation and adhesive force, notably enhanced thermal conductivity, and at the same time, excellent heat-radiation properties, and a manufacturing method therefor. Accordingly, the present invention may be widely applied in all industries requiring insulation and heat-radiation properties.

Inventors:
MIN EUI HONG (KR)
CHO JEONG WOO (KR)
LEE DONG WON (KR)
NOH HYUN SOO (KR)
HAN HYE JIN (KR)
Application Number:
PCT/KR2016/015313
Publication Date:
July 05, 2018
Filing Date:
December 27, 2016
Export Citation:
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Assignee:
SOLUETA (KR)
International Classes:
C09J7/00; C09J11/04; C09J201/00
Foreign References:
KR20150095478A2015-08-21
KR20150105410A2015-09-16
CN101130461A2008-02-27
JP2012109312A2012-06-07
KR101549986B12015-09-03
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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