Title:
INSULATIVE SUBSTRATE-LESS HEAT-RADIATION TAPE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/124319
Kind Code:
A1
Abstract:
The present invention relates to an insulative substrate-less heat-radiation tape and a manufacturing method therefor, and more specifically, to an insulative substrate-less heat-radiation tape exhibiting excellent insulation and adhesive force, notably enhanced thermal conductivity, and at the same time, excellent heat-radiation properties, and a manufacturing method therefor. Accordingly, the present invention may be widely applied in all industries requiring insulation and heat-radiation properties.
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Inventors:
MIN EUI HONG (KR)
CHO JEONG WOO (KR)
LEE DONG WON (KR)
NOH HYUN SOO (KR)
HAN HYE JIN (KR)
CHO JEONG WOO (KR)
LEE DONG WON (KR)
NOH HYUN SOO (KR)
HAN HYE JIN (KR)
Application Number:
PCT/KR2016/015313
Publication Date:
July 05, 2018
Filing Date:
December 27, 2016
Export Citation:
Assignee:
SOLUETA (KR)
International Classes:
C09J7/00; C09J11/04; C09J201/00
Foreign References:
KR20150095478A | 2015-08-21 | |||
KR20150105410A | 2015-09-16 | |||
CN101130461A | 2008-02-27 | |||
JP2012109312A | 2012-06-07 | |||
KR101549986B1 | 2015-09-03 |
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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