Title:
INSULATIVE AND THERMALLY CONDUCTIVE RESIN COMPOSITION AND FORMED ARTICLE, AND METHOD FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2006/132185
Kind Code:
A1
Abstract:
Provided is an insulative and thermally conductive composition comprising 15 vol % or more of a matrix resin, an electrically insulating filler, a metal powder having a melting point of 500&ring C or higher and a low melting point alloy having a melting point of 500&ring C or less. The resin composition is excellent in forming processability and can produce a formed article having high insulating property and thermal conductivity. Furthermore,a method for producing the resin composition and a method for producing the formed article are also provided.
Inventors:
AGARI YASUYUKI (JP)
KAMIYAHATA TSUNEO (JP)
INADA YOSHIKAZU (JP)
KAMIYAHATA TSUNEO (JP)
INADA YOSHIKAZU (JP)
Application Number:
PCT/JP2006/311231
Publication Date:
December 14, 2006
Filing Date:
June 05, 2006
Export Citation:
Assignee:
NIPPON KAGAKU YAKIN KK (JP)
AGARI YASUYUKI (JP)
KAMIYAHATA TSUNEO (JP)
INADA YOSHIKAZU (JP)
AGARI YASUYUKI (JP)
KAMIYAHATA TSUNEO (JP)
INADA YOSHIKAZU (JP)
International Classes:
C08L101/00; C08K3/08; C08K7/00; C09K5/08
Domestic Patent References:
| WO2003029352A1 | 2003-04-10 |
Foreign References:
| JP2006022130A | 2006-01-26 | |||
| JPH06196884A | 1994-07-15 | |||
| JPH1112481A | 1999-01-19 | |||
| JPS60202607A | 1985-10-14 |
Attorney, Agent or Firm:
Kawamiya, Osamu (IMP Building 3-7, Shiromi 1-chome, Chuo-k, Osaka-shi Osaka 01, JP)
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