Title:
INSULATOR COMPOSITION INCLUDING THERMOPLASTIC POLYMER
Document Type and Number:
WIPO Patent Application WO/2024/080423
Kind Code:
A1
Abstract:
The present invention relates to an insulator composition usable for a variety of power components and, more specifically, provides an insulator composition in which a very small amount of thermoplastic polymer is mixed in a polymer substrate to improve the insulating characteristic of an insulator used for power components.
Inventors:
YU SEUNG GUN (KR)
LEE DAE HO (KR)
HAN SE WON (KR)
KIM DO GEON (KR)
LEE SEONG HWAN (KR)
LEE DAE HO (KR)
HAN SE WON (KR)
KIM DO GEON (KR)
LEE SEONG HWAN (KR)
Application Number:
PCT/KR2022/015830
Publication Date:
April 18, 2024
Filing Date:
October 18, 2022
Export Citation:
Assignee:
KOREA ELECTROTECHNOLOGY RES INSTITUTE (KR)
International Classes:
C08L23/12; C08L25/06; C08L27/16; C08L33/12; C08L101/00; H01B3/30; H01B3/44
Attorney, Agent or Firm:
PUKYUNG INTERNATIONAL PATENT & LAW FIRM (KR)
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