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Patent Searching and Data


Title:
INTEGRAL PACKAGING PROCESS-BASED CAMERA MODULE, INTEGRAL BASE COMPONENT OF SAME, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/140092
Kind Code:
A1
Abstract:
A camera module, an integral base component of same, and a manufacturing method therefor. The camera module comprises: at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component comprises a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

Inventors:
WANG MINGZHU (CN)
ZHAO BOJIE (CN)
TANAKA TAKEHIKO (JP)
GUO NAN (CN)
CHEN ZHENYU (CN)
HUANG ZHEN (CN)
CHEN FEIFAN (CN)
DING LIANG (CN)
Application Number:
PCT/CN2016/092020
Publication Date:
August 24, 2017
Filing Date:
July 28, 2016
Export Citation:
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Assignee:
NINGBO SUNNY OPOTECH CO LTD (CN)
International Classes:
H04N5/225; G03B17/12; H01L23/31
Foreign References:
CN105704354A2016-06-22
CN105744130A2016-07-06
CN105611134A2016-05-25
CN105721754A2016-06-29
CN103700634A2014-04-02
US20140071327A12014-03-13
Other References:
See also references of EP 3419275A4
Attorney, Agent or Firm:
NINGBO RAYMOND IP AGENCY FIRM (CN)
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