INTEGRALLY MOLDED BODY AND METHOD FOR PRODUCING SAME

Title:

INTEGRALLY MOLDED BODY AND METHOD FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2018/110293

Kind Code:

A1

Abstract:

Provided is an integrally molded body in which a bonding resin (C) is interposed between a board (A) and a member (B), the surface on one side of the board being a design surface, wherein: the member (B) has, on the inside thereof, a first bonding section which is arranged so as to space apart the board (A) and the member (B) and by which at least a partial region of an outer peripheral edge section of the board (A) bonds to the bonding resin (C); and at least a part of the design surface-side surface of the integrally molded body has a region where the board (A), the member (B), and the bonding resin (C) are exposed. The invention allows for a plurality of structures to be bonded with high bonding strength and allows for the bonding boundary thereof to have favorable smoothness, thereby making it possible to mitigate warping and reduce weight and thickness even when the molded body has a board constituent member.

Inventors:

SASAKI HIDEAKI (JP)
TAKAHASHI YUKI (JP)
SHIOZAKI KEISUKE (JP)

Application Number:

PCT/JP2017/043037

Publication Date:

June 21, 2018

Filing Date:

November 30, 2017

Export Citation:

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Assignee:

TORAY INDUSTRIES (JP)

International Classes:

B29C45/14; B29C45/26; B29C65/70

Foreign References:

JP2016097589A	2016-05-30
JP2005297581A	2005-10-27
JP2000272014A	2000-10-03
JP2003025837A	2003-01-29
JP2003236877A	2003-08-26
JPH11179758A	1999-07-06
JP2000272014A	2000-10-03
JP2008034823A	2008-02-14

Other References: