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Patent Searching and Data


Title:
INTEGRALLY MOLDED BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/142971
Kind Code:
A1
Abstract:
Provided is an integrally molded body in which a separate structure (C) has been joined to at least part of an end section of a sandwich structure constituted of a core layer composed of non-continuous fibers and a thermoplastic resin (A) and a skin layer composed of continuous fibers and a resin (B), wherein: the sandwich structure has an stepped section at at least part of an end section, the stepped section being constituted of a main body section forming a high surface in the stepped section, an interface section forming an interface joining the high surface and a low surface of the stepped section, and a thinnest section where the core layer has a lower porosity than the porosity of the core layer in the main body section; and the separate structure (C) does not border on the interface, and is bonded to only at least a part of the thinnest section. Also provided is a method for producing same. Obtained is an integrally molded body that is lightweight, strong, rigid, and thin, yet is excellent in terms of design.

Inventors:
NAKAYAMA HIROYUKI (JP)
SASAKI HIDEAKI (JP)
MORIUCHI MASANARI (JP)
Application Number:
PCT/JP2018/001605
Publication Date:
August 09, 2018
Filing Date:
January 19, 2018
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B32B3/02; B29C43/20; B29C43/34; B29C69/00; B32B5/28; B29K101/12; B29L9/00
Domestic Patent References:
WO2006028107A12006-03-16
Foreign References:
JP2016049649A2016-04-11
JP2007526150A2007-09-13
JP2007038519A2007-02-15
JP2009113244A2009-05-28
JP2012000890A2012-01-05
JP2013198984A2013-10-03
JP2016049649A2016-04-11
Other References:
See also references of EP 3578353A4
Attorney, Agent or Firm:
BAN Toshimitsu et al. (JP)
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