Title:
INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2003/077317
Kind Code:
A1
Abstract:
An integrated circuit device being built in an electronic apparatus, e.g. a high frequency power amplifier being built in a portable telephone, characterized by comprising a wiring board having one or a plurality of through holes extending from the major surface to the rear surface at specified positions, a metal foil formed on the rear surface of the wiring board, a semiconductor element secured onto the metal foil at the bottom of the through hole, and an external electrode terminal formed on the rear surface side of the wiring board. Surface of the semiconductor element is connected with the principal surface of the wiring board through a conductive wire and a passive element is formed on the principal surface of the wiring board.
Inventors:
KURODA NAOKI (JP)
YAMAURA MASASHI (JP)
ENDOH TSUNEO (JP)
TANIMOTO KOKI (JP)
KOBAYASHI YOSHIHIKO (JP)
YAMAURA MASASHI (JP)
ENDOH TSUNEO (JP)
TANIMOTO KOKI (JP)
KOBAYASHI YOSHIHIKO (JP)
Application Number:
PCT/JP2002/002188
Publication Date:
September 18, 2003
Filing Date:
March 08, 2002
Export Citation:
Assignee:
HITACHI LTD (JP)
HITACHI TOBU SEMICONDUCTOR LTD (JP)
KURODA NAOKI (JP)
YAMAURA MASASHI (JP)
ENDOH TSUNEO (JP)
TANIMOTO KOKI (JP)
KOBAYASHI YOSHIHIKO (JP)
HITACHI TOBU SEMICONDUCTOR LTD (JP)
KURODA NAOKI (JP)
YAMAURA MASASHI (JP)
ENDOH TSUNEO (JP)
TANIMOTO KOKI (JP)
KOBAYASHI YOSHIHIKO (JP)
International Classes:
H01L23/13; H01L23/538; H01L23/66; H05K1/18; (IPC1-7): H01L25/00; H01L21/56
Foreign References:
| JPH0837378A | 1996-02-06 | |||
| JP2001217372A | 2001-08-10 | |||
| JPH10150127A | 1998-06-02 | |||
| JPH10189627A | 1998-07-21 |
Attorney, Agent or Firm:
Akita, Shuki (Twintabata Bldg. B 13-9, Higashi-Tabata 1-chom, Kita-ku Tokyo, JP)
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