INTEGRATED CIRCUIT FILM FOR USE IN COMMUNICATION DEVICES AND APPLICATION THEREOF

WIPO Patent Application WO/2017/120799

A1

An integrated circuit film (1) for use in communication devices and applications thereof, comprising a plurality of film contact points (11), wherein the layout of said film contact points (11) corresponds to the layout of a plurality of chip pins on an external SIM card (2); an integrated circuit chip (12) connecting to at least one of said firm contact points (11), wherein the layout of said integrated circuit chip (12) corresponds to the layout of one the chip pins of said SIM card, and said integrated circuit chip (12) further comprising: a communication circuit (121) used to establish a communications connection with an external mobile communications device (3); a smart thin-film operating system (122), connecting to said communication circuit (121), wherein the smart thin-film operating system (122) also responds to a first service instruction according to a notification sent by the mobile communications device (3). Said mobile communications device (3) accesses the SIM card (2) by means of the integrated circuit film (1), and owing to the user being able to write actions within the integrated circuit film (1), quicker operations of the mobile communications device (3) can be achieved.

WO/2023/097969	PASSIVE RADIO FREQUENCY TAG
JP5111751	Manufacturing method of semiconductor devices
JPH028949	MULTIFUNCTIONAL CARD

HUANG CHIN TE (CN)
LEE GUI YUN (CN)
CHIANG LI AN (CN)
WANG CHUN CHIAO (CN)
TU KUN HSIEN (CN)

PCT/CN2016/070806

July 20, 2017

January 13, 2016

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CHILITAG TECH LTD (CN)

G06K19/077

TWM361831U	2009-07-21
TWM288959U	2006-03-21
JP2002236901A	2002-08-23
TW201123016A	2011-07-01
CN201413527Y	2010-02-24

CHINA TRUER IP (CN)

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