Title:
INTEGRATED CIRCUIT SENSOR AND SENSOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/038196
Kind Code:
A1
Abstract:
Provided is an integrated circuit sensor with which it is possible to reliably bring into contact a body to be inspected and the surface of an integrated circuit across a wide area irrespective of the type of body to be inspected. A through-silicon via (11) electrically connecting the interior of an integrated circuit sensor (4) and the exterior of the integrated circuit sensor (4) is formed in the interior of the integrated circuit sensor (4) so as to reach the reverse surface of the integrated circuit sensor (4), which faces the surface of the integrated circuit sensor (4).
Inventors:
IIZUKA KUNIHIKO
SAITO AKIRA
MITSUNAKA TAKESHI
ASHIDA NOBUYUKI
SAITO AKIRA
MITSUNAKA TAKESHI
ASHIDA NOBUYUKI
Application Number:
PCT/JP2016/067316
Publication Date:
March 09, 2017
Filing Date:
June 10, 2016
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
G01N27/22; G01N27/02; G01N27/72; H01L21/822; H01L27/04
Foreign References:
| JP2003536085A | 2003-12-02 | |||
| JP2010101864A | 2010-05-06 | |||
| JP2012215469A | 2012-11-08 | |||
| JP2009080091A | 2009-04-16 | |||
| JP2005338980A | 2005-12-08 | |||
| JP3326791B2 | 2002-09-24 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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