Title:
INTEGRATED COOLING MODULE
Document Type and Number:
WIPO Patent Application WO/2022/245155
Kind Code:
A1
Abstract:
The present invention relates to an integrated cooling module that has a mounting space provided therein in which components can be mounted, and a refrigerant flow channel formed thereinside through which a refrigerant can flow, and through a central manifold having communication holes formed therein for communicating the refrigerant flow channel with each of the components, eliminates hoses or piping by integrating each component around the central manifold, thereby achieving miniaturization and weight reduction of the entirety of a cooling system.
Inventors:
RHEE SANGYONG (KR)
HWANG IN-GUK (KR)
LEE SANG OK (KR)
HWANG IN-GUK (KR)
LEE SANG OK (KR)
Application Number:
PCT/KR2022/007185
Publication Date:
November 24, 2022
Filing Date:
May 19, 2022
Export Citation:
Assignee:
HANON SYSTEMS (KR)
International Classes:
B60H1/32; F01P3/18; F28D9/00
Foreign References:
| US20190039440A1 | 2019-02-07 | |||
| US20090205359A1 | 2009-08-20 | |||
| KR20190061821A | 2019-06-05 | |||
| KR20210010121A | 2021-01-27 | |||
| JP2019533797A | 2019-11-21 |
Attorney, Agent or Firm:
PLUS INTERNATIONAL IP LAW FIRM (KR)
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