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Patent Searching and Data


Title:
INTEGRATED DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/145555
Kind Code:
A1
Abstract:
Provided is an integrated device with superior insulation resistance. A channel (150) constituted with an inclined surface on a side surface (152) is provided between adjacent devices. When the front surface is a side on which an electronic circuit or a MEMS device is provided, the channel (150) narrows from the front surface toward the back surface because of the inclined surface. By interposing a molded material (insulating material) (160) in the channel (150), a plurality of devices can be mechanically joined in a state of electrical insulation from each other. In the forming of wiring material (171) that electrically connects adjacent devices to each other, forming is carried out along the side surfaces and bottom surface of the channel (150). When extracting wiring from the back surface, a hole is formed in the bottom surface (151) of the channel (150), and the wiring material (171) is exposed on the back surface by the hole.

Inventors:
MAKIHATA MITSUTOSHI (JP)
ESASHI MASAYOSHI (JP)
TANAKA SHUJI (JP)
MUROYAMA MASANORI (JP)
FUNABASHI HIROFUMI (JP)
NONOMURA YUTAKA (JP)
HATA YOSHIYUKI (JP)
YAMADA HITOSHI (JP)
NAKAYAMA TAKAHIRO (JP)
YAMAGUCHI UI (JP)
Application Number:
PCT/JP2013/001218
Publication Date:
October 03, 2013
Filing Date:
February 28, 2013
Export Citation:
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Assignee:
UNIV TOHOKU (JP)
TOYOTA CHUO KENKYUSHO KK (JP)
TOYOTA MOTOR CO LTD (JP)
MAKIHATA MITSUTOSHI (JP)
ESASHI MASAYOSHI (JP)
TANAKA SHUJI (JP)
MUROYAMA MASANORI (JP)
FUNABASHI HIROFUMI (JP)
NONOMURA YUTAKA (JP)
HATA YOSHIYUKI (JP)
YAMADA HITOSHI (JP)
NAKAYAMA TAKAHIRO (JP)
YAMAGUCHI UI (JP)
International Classes:
H01L25/04; G01L9/00; H01L21/76; H01L21/822; H01L25/18; H01L27/04
Foreign References:
JP2007260866A2007-10-11
JP2003124431A2003-04-25
Attorney, Agent or Firm:
IEIRI, Takeshi (JP)
House ON 健 (JP)
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