CROSS-REFERENCE TO RELATED APPLICATION

[0001] This Application claims the benefit of U.S. Provisional Application, Serial No. 63/310,383, filed on February 15, 2022, entitled: A DOCKING STATION FOR BIOFLUID ANALYSIS OF AN OPTICAL SIGNAL RECEIVED FROM AN EXTERNAL PHOTONIC SENSOR, commonly assigned with the present disclosure, and incorporated herein by reference and U.S. Provisional Application, Serial No. 63/310,331 filed on February 15, 2022, entitled BIOFLUID COLLECTOR AND ADAPTER FOR USE WITH A DOCKING STATION FOR BIOFLUID ANALYSIS.

TECHNICAL FIELD OF THE DISCLOSURE

[0002] The present disclosure is directed to an integrated docking station having an internal interferometer for analyzing an optical signal obtained from an unknown analyte for purposes of identifying constituents within the analyte using spectral analysis. The integrated docking station provides analysis of an analyte containing various unknown constituents, such as illicit or prescribed drugs, or alcohol in a fluid, such as urine, breath condensate, salvia, or other biofluids and for the detection of pathogens .

BACKGROUND OF THE DISCLOSURE [ 0003 ] Detection of drugs and abuse of prescription drugs or driving under the influence of one of these drugs or alcohol , drug and/or alcohol testing has become more common place in many industries , hospitals , and law enforcement . The tests that can currently be conducted, such as immunoassay, however, it has drawbacks . For example , it doesn' t pick up on all opioids , and it sometimes gives false positives . Another type of drug screen test is conducted using a gas chromatography/mass spectrometry GC/MS ) , which is a process in which a chemical mixture carried by a liquid or gas is separated into components because of dif ferential distribution of the solutes as they flow around or over a stationary liquid phase . This type of test uses the same procedure as the immunoassay, but it is more expensive and takes longer to get test results from the laboratory . For example , depending on the drug for which the test is being conducted, the results may not be available for several hours or several days . Some tests may even take up to 3 to 4 weeks before results are known .

[ 0004 ] Another testing area involves breathalyzers used in law enforcement . There are di fferent types of analyzers presently used . One type is a passive breathalyzer . This type has internal fuel sensors that are designed to detect the presence of alcohol when a motorist exhales near the analyzer . The other type is an active breathalyzer . This type of analyzer requires the driver to blow into a mouthpiece to determine the driver' s body alcohol content . Both types analyze only the presence of or blood-alcohol content of alcohol of the driver . However, neither type of device can analyze any other type of intoxicating substance, such as cannabis . Analysis for these types of drugs require a blood test , which often requires a warrant, by which time, the drug content in the suspect' s body may have depreciated below legal threshold limits .

[ 0005 ] Additionally, given the current global health climate, there is a need for rapid detection of possibly infected individuals of various types of pathogens , such as viruses of dif ferent types . Current testing technologies do not provide a means for quickly obtaining and reporting results . For example , current testing technologies require several days in which to ascertain the presence of a virus . Moreover, i f the subj ect has not been infected for enough time, the test may indicate a false negative , thereby unknowingly causing exposure to the general populous . Current testing technology also lacks the ability to rapidly identi fy and track mutations . Further, the delayed reporting time causes governmental authorities to lack current data that can be critical in forming and implementing the appropriate policies .

SUMMARY OF THE DISCLOSURE

[ 0006 ] To address the above-discussed, this disclosure provides embodiments of a portable, integrated docking station that comprises , a power supply, a laser, microprocessor, and an optical interface located on an exterior face of the integrated docking station that is configured to receive coupling ends of a photonic chip to provide optical coupling between the photonic chip and the integrated docking station . The interface forms an open optical path, wherein the optical path is completed upon insertion of the photonic chip into the optical interface . These embodiments further include an integrated interferometer, including a fixed optical system comprising a beam splitter, interference gratings , a focusing lens , and an adj ustable photodetector . The components of the interferometer are thermally isolated from heat sources , such as the laser and microprocessor, within the integrated docking station . The above-mentioned components are all contained within a compact integrated docking station housing that is easily portable .

[ 0007 ] The foregoing has outlined features so that those skilled in the art may better understand the detailed description that follows . Additional features will be described hereinafter that can form the subj ect of the claims . Those skilled in the art should appreciate that they can readily use the disclosed conception and specific examples as a basis for designing or modifying other structures for carrying out the same purposes disclosed herein . Those skilled in the art should also reali ze that such equivalent constructions do not depart from the spirit and scope of the disclosure .

BRIEF DESCRIPTION OF THE DRAWINGS [0008] For a more complete understanding of the present disclosure, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which: [0009] FIG. 1A illustrates an embodiment of an integrated docking station with a collector optically coupled to the integrated docking station;

[0010] FIG. IB illustrate an embodiment of the collector of FIG. 1A;

[0011] FIG. 2A illustrates an isometric view of an embodiment of a photonic module housing a photonic chip assembly that can be used in a collector;

[0012] FIG. 2B illustrates a sectional view of the embodiment of FIG. 2A;

[0013] FIG. 2C illustrates an enlarged partial view of the FIG. 2B;

[0014] FIG. 2D illustrates an overhead view of an embodiment of a waveguide comprising the photonic chip assembly;

[0015] FIG. 2E illustrates a schematic sectional view of an example of a waveguide showing the individual waveguide ridges and optional nanoparticles;

[0016] FIGs. 3A-3D illustrate and embodiment of the integrated docking station to which the collectors can be optically connected;

[0017] FIG. 3E illustrates an embodiment of an interferometer that is included in the integrated docking station; [0018] FIG. 3F illustrates an embodiment of a docking port that can be included in the integrated docking station;

[0019] FIG. 3G illustrates an adjusting plate that can be included in the integrated docking station and used to adjust the photodetector;

[0020] FIG. 4A illustrates another embodiment of the integrated docking station wherein a laser and interferometer are in one section and electronic components are in another section; [0021] FIG. 4B illustrates another embodiment of the integrated docking station of FIG. 4A.

[0022] FIG. 5 is a schematic view of an embodiment of the integrated docking station.

DETAILED DESCRIPTION

[ 0023 ] There is a need for an analytical system that can provide rapid results regarding the analysis , detection, or quantification of target analytes within a fluid . Non-limiting examples of such fluids include illicit or prescription drugs , or alcohol in bodily fluids , such as blood, urine or salvia or breath condensate , pathogens , or other chemical compounds contained in these fluids . As is known, an analyte is a chemical ( including biological chemicals ) substance that is the subj ect of an analytical process . Currently, it can take days , or in some cases , even weeks to get accurate results from current analytical processes that involve urine analysis , for example . In cases when breath condensate is the collection means , results can be near instantaneous , however, those results are limited to certain types of analytes , such as alcohol and cannot detect other analytes , such as cannabis , which may be impairing the driver . By the time blood can be obtained based on a warrant, the amount of cannabis in the individual may have dropped below legal threshold limits , thereby allowing the individual to evade citation or arrest .

[ 0024 ] The various embodiments of the present disclosure provide an integrated docking station that receives an optical signal from a photonic chip assembly onto which a target analyte fluid has been applied . In some embodiments , the photonic chip assembly may be contained within a biofluid collector . The analysis of the analyte applied to the photonic chip assembly when optically coupled to the integrated docking station can provide highly accurate results within minutes and without the need of reagents associated with conventional processes , such as immunoassays or GC/MS systems .

[ 0025 ] FIG . 1A is an isometric view of an embodiment of a photonic based analytical system 100 that addresses the abovenoted needs . The illustrated embodiment comprises an integrated docking station 105 and fluid collector (hereinafter "collector" 110 ) capable of holding a fluid that is optically coupled to the integrated docking station 105 through a photonic chip assembly 115 . The collector 110 may have several configurations designed to hold the fluid . For example , the collector 110 be a cup, as shown, a tube , a test card, or condensate tube . As mentioned above , any number of fluids that need analysis can placed within the collector 110 . The collector 110 includes the photonic chip assembly 115 , as described in more detail below, that is located in a base 110b of the collector 110 that has a fluid port 110c therein . As explained below, the photonic chip assembly 115 receives an input optical signal from the integrated docking station 105 and transmits an output optical signal to the integrated docking station 105 , which then analyzes the optical signal to provide qualitative and/or quantitative data regarding the fluid in the collector 110 .

[ 0026 ] The photonic chip assembly 115 located within the collector 110 is configured to be received within a docking port

120 of the integrated docking station 105 , through which optical coupling between the photonic chip assembly 115 and integrated docking station 105 is achieved . As used herein and in the claims , the phrases "optically couplable , optically coupled, optically connected or optical coupling, " including grammatical variations thereof , mean that light couples from one waveguide to another waveguide . When the collector 110 is inserted into the integrated docking station 105, the photonic chip assembly 115 completes or closes the optical path, otherwise the optical path within the integrated docking station 105 remains in an open state . The photonic transmission between the photonic chip assembly 115 within the collector 110 and the integrated docking station 105 provides rapid and accurate test results of the analyte . The integrated docking station 105 has a compact , light-weight configuration that makes it easily portable .

[ 0027 ] FIG . IB illustrates one embodiment of the collector 110 as in FIG . 1A. In this embodiment , collector 110 is a modified specimen cup . It may be comprised of any shapable material , but in one embodiment , the collector 110 comprises plastic . The collector 110 has a body 110a designed to hold a fluid therein and a base 110b that includes a fluid port 110c located in the base 110b through which a test fluid may flow . As used herein and in the claims , a "base" is that portion of the collector 110 in which the photonic chip assembly 115 is located . The base 110b has a cavity l l Od formed in it that serves as a docking cavity and is sized to receive the photonic chip assembly 115 therein, embodiments of which are described below in more detail . In this embodiment , the photonic chip assembly 115 is positioned within the cavity l l Od and under the fluid port 110c such that it can receive a fluid flow from the body 110a . In the illustrated embodiment , the photonic chip assembly 115 is horizontally oriented such that the optical path from the photonic chip assembly 115 to the optical connectors 225 is oriented parallel with the diameter of the base 110b . This hori zontal orientation allows the collector 110 to be inserted into the docking port 120 of the integrated docking station 105 ( FIG . 1A) in a horizontal orientation with respect to the docking port 120 . An adhesive may be used to secure the photonic chip assembly 115 within the cavity l l Od, or the cavity l l Od may be designed such that the photonic chip assembly 115 is secured by a friction fit within the cavity l l Od .

[ 0028 ] A known sealing material can be used to form a fluid tight seal between the fluid port 110c and the photonic chip assembly 115. In those embodiments where an adhesive is used, the adhesive may also serve to provide this fluid tight seal . As seen in the illustrated embodiment, the photonic chip assembly 115 is inserted in the cavity l l Od to about half the length of the base 110b . However, in other embodiments , the length of the cavity l l Od may be such that it positions optical connectors of the photonic chip assembly 115 j ust within or at the edge of opening of the cavity l l Od . This position allows the optical connectors to be protected from physical damage, while still be able to be inserted into the integrated docking station for optical connection therewith . The photonic chip assembly 115 is positioned below the fluid port 310 such that biofluid within the collector 110 flows onto the photonic chip assembly 115. This brings the analyte ( s ) into contact with a waveguide of the photonic chip assembly 115 . Thereafter, quantitative or qualitative photonic analysis in cooperation with the integrated docking station 105 ( FIG . 1A) can be conducted regarding any analyte ( s ) that may be present in the biofluid .

[ 0029 ] FIGs . 2A and 2B illustrate an isometric view and a sectional view, respectively, of one embodiment of the photonic chip assembly 115 . The photonic chip assembly 115 comprises a waveguide 115a, an embodiment of which is described below in more detail . The waveguide 115a has input/output ends 115b, and optical fibers 115c, shown in dashed lines in FIG . 2A. Optical fibers 115c, extend through respective optical connectors 115d and terminate at the respective ends of the optical connectors 115d . One of the optical fibers 115c optically aligns with one of the input/output ends 115b of the waveguide 115a to provide an input end of the photonic chip assembly 115 , and the other one of the input/output ends 115b optically aligns with the other of the input/output ends 115b of the waveguide 115a to provide an output end of the photonic chip assembly 115. In an embodiment, the optical fibers 115c are conventional glass fibers that comprises an inner core and an outer cladding, wherein the inner core and outer cladding have di f ferent indexes of refraction between the two materials to cause light to propagate along the inner cord . In an embodiment, the optical fibers 115c have a lensed end located on the end that optically couples with the input/output ends 115b of the photonic chip assembly 115 and are positioned within v-grooves to hold the optical fibers 115c in an optically aligned position with the photonic chip assembly 115 .

[ 0030 ] In one embodiment , the optical connectors 115d may be a known optical connector type , such as a ferrule . The optical connectors 115d provide strength, rigidity, and support for the input and output fibers 115c . In one embodiment , the optical connectors 115d may be comprised of a ceramic material , however, other known materials may be used, such as metal .

[ 0031 ] The optical fibers 115c have respective first ends that terminate at or proximate the end of the optical connectors 115d, while the other ends are positioned proximate the input/output ends 115b of the photonic chip assembly 115 at a distance suf ficient to provide optical coupling between the waveguide 115a and the optical fibers 115c, as generally shown . In one embodiment , the input/output ends 115b of the waveguide 115a and optical fibers 115c are separated by several microns , for example , in one embodiment , they may be separated by 10 to 20 microns . However, in other embodiments , the input/output ends 115b and optical fibers 115c may abut one another . As mentioned above , in an embodiment, the coupling end of the optical fibers 115c at the input/output ends 115b are lensed, while the other lens that extends through the optical connectors 115d are flat of angled, for instance at an angle of 8 ° . In the embodiment where the lens ends are present , the lens improves the light coupling from a light source , such as a laser, of the integrated docking station and into the input of the photonic chip assembly 115 and light emerging from the output of the photonic module 220 . In one embodiment, the radius of curvatures of the lenses may be dif ferent . For example , in one embodiment , the radius of curvature of the input lens may be half that of the output lens . In such embodiments , the degree of separation between the input/output ends 115b and the optical fibers 115c may depend on the working distance of the lensed optical fiber . The input/output ends 115b of the photonic chip assembly 115 and the optical fibers 115c have a composition that transmits light along an optical path .

[ 0032 ] In one embodiment as illustrated embodiment in FIG . 2A, the photonic chip assembly 115 comprises a housing 205 that is an optional feature, which may be comprised of a moldable material or other machinable material that provides structural support , such as plastic, metal , or ceramics . When the photonic chip assembly 115 is contained within the housing 205 , it forms a photonic module 220 . The housing 205 has as upper surface 205a that includes an opening 210 through which a fluid may be applied to the photonic chip assembly 115 from the collector 110 . However, in other applications , the fluid may be applied directly into the photonic chip assembly 115 . In another embodiment , a fluid reservoir 210a may be located over the opening 210 to further expand the volume fluid capacity into which a subj ect analyte can be placed . In such embodiments , the subj ect fluid would flow from the fluid reservoir 210a, and through the opening 210 . The housing 205 prevents fluid from entering the housing 205 except through opening 210 or fluid reservoir 210a, as see in FIG . 2B . In one embodiment , a filter 215 is present . In such embodiments , the fluid flows through the filter 215 before flowing onto and wetting the photonic chip assembly 115 that is located under the filter 215. This filter 215 may be comprised of known filtration materials and is present in those embodiments when it is desired to filter out particulates in the biofluid .

[ 0033 ] As seen in FIG . 2B, the photonic chip assembly 115 further comprises a substrate 115e on which the optical fibers 115c are also located, thereby forming an integrated photonic chip assembly, V-groove design . In one embodiment, the substrate 115e is located on a base substrate 115f that may comprise a material , such as silica or quartz to provide further structural support to the integrated design . In one embodiment , each of the optical fibers 115c, only one of which is shown in this sectional view, is positioned in a V-groove 115g formed in substrate 115e and si zed to hold the optical fibers 115c, while the optical connectors 115d are located within a larger V-groove 115h formed in the substrate 115e and sized to hold the optical connector 115d in position on the substrate 115e . The optical fiber ( s ) 115c+ may be further secured in place by a holding cap 230 , comprised of , for example , of quartz , silica, plastic, or other ridged material, and the optical connector (s) may be held in place by a holding cap 235 comprised of similar materials to that of the holding cap 230. In one embodiment the substrate 115e may be comprised of silicon. In one embodiment, the photonic chip assembly 115 includes a trench 115i that is located between the input/output ends 115b of the photonic chip assembly 115 and the input end and output end of the optical fiber (s) 115c, as generally shown.

[0034] FIG. 2C is an enlarged view of an embodiment that further illustrates the trench 115i and the optical fiber (s) 115c positional relationship with the input/output ends 115b of the photonic chip assembly 115. In one embodiment, the trench 115i may include a stair-stepped profile 115j to ensure proper offset of the optical fiber (s) 115c from the input/output ends 115b of the photonic chip assembly 115. In one embodiment, the input/output ends 115b of the photonic chip assembly 115 are faceted and terminate at or near a faceted surface 115k of the photonic chip assembly 115. In an embodiment, the faceted surface 115k is a surface having a near vertical orientation (for example an angle of about 90°, ±4°) to enhance light coupling between the photonic chip assembly 115 and the optical fiber 115c.

[0035] The photonic chip assembly 115 used in the various embodiments of this disclosure comprise the waveguide 115a that includes those embodiments as disclosed in US Publication No. 2021/0293716, filing date of March 17, 2021, which is incorporated herein by reference for all intents and purposes. In one such embodiment, as seen in FIG. 2D, the photonic chip assembly 115 comprises a planar waveguide 240, that in one embodiment, may have a serpentine configuration of various geometric designs. The waveguide 240 has an optical input fiber 240a and optical output fiber 240b. As discussed above, the optical input fiber 240a and optical output fiber 240b optically couple to the input end and output ends optical fibers 115c, respectively, that extend through and to or near the end of the optical connectors 115d.

[0036] FIG. 2E is a schematic sectional view of one embodiment of the waveguide 115a that can be used. In this view, the waveguide 115a is patterned over the substrate 115e. In one embodiment, the substrate 115e, as discussed above, may be comprised of a known semiconductor material, for example, silicon or silicon dioxide. In an embodiment, the waveguide 115a is patterned to from a planar waveguide, where each ridge 1151 has exposed side surfaces 115m and an uppermost surface 115n, as seen in the schematic sectional view of FIG. 2D. In one embodiment, the waveguide 115a may be comprised of a silicon nitride material, such as SiN2, SisNs, SiON, which can be deposited and etched using known lithographic and deposition processes. Silicon nitride is given as an example, but the waveguide 115a may comprise other types of materials, such as Gallium Arsenide, Aluminum Gallium Arsenide, Silicon, Aluminum Oxides, Silicon Oxy-Nitrides, Doped

Silicon dioxide (Titanium, Lithium, phosphorus, boron, etc.) , or combinations thereof , are also within the scope of this disclosure .

[ 0037 ] In one embodiment , nanoparticles 245, such as silver, gold, copper, platinum, palladium, aluminum, or combinations thereof are located on or ("or" as used herein and in the claims includes conj unctive and disj unctive forms , "and/or" ) may be located adj acent at least a portion of the ridges 1151 of the waveguide 115a, that is , the nanoparticles 245 are close enough to enhance the charge transfer, or plasmonic resonance of the optical signal being transmitted by the waveguide 115a . In one embodiment , the concentration of the nanoparticles 245 is greater on or adj acent the side surfaces 115m than on the uppermost surfaces 115n, as generally illustrated in FIG . 2D . For purposes herein and in the claims , "uppermost surface" is the surface of the ridge 1151 that extends the furthest from the substrate 115e in a vertical orientation . In one embodiment , the nanoparticles 245 extend along a sensor portion of the length of the waveguide 115a . The sensor portion is that portion of the waveguide 115a that is uncladded and from which test data is collected and used to determine the test results . The sensor portion may extend the length of the waveguide 115a or only a portion of it .

[ 0038 ] In those embodiments where the nanoparticles 245 are present , their larger concentration adj acent or at the side surfaces 115m improves the plasmonic resonance coupling of light from the waveguide with the analyte to provide improved data collection as it relates to the target analyte . Though metals are mentioned specifically, other highly conductive materials that can be deposited or formed at the nanoscale may also be used . For example , a nanostructured semiconductor surface may also be used to shape the charge transfer, or plasmonic resonance as well . Semiconducting materials that have been considered for use include narrow bandgap materials such as silicon carbide, carbon, or gallium nitride as well as narrower bandgap materials such as germanium, lead selenide, lead telluride, Gallium Antimonide , Gallium Arsenide, Indium Phosphide . There are additionally, several evolving semiconductors whose nanostructure behaviors may have unique benefits , such as the chalcoginide molybdenum disul fide (M0S2 ) . Chalcogenide is a chemical compound consisting of at least one chalcogen anion and at least one more electropositive element . Although all group 16 elements of the periodic table are defined as chalcogens , the term chalcogenide is more commonly reserved for sul fides , selenides , tellurides , and polonides , rather than oxides .

[ 0039 ] Reference is made with respect to the embodiment of the integrated docking station 300 illustrated in FIG . 3A, which for purposes of discussion, is horizontally oriented and in which the sections are stacked in a vertical fashion . The integrated docking station 300 , however, is not limited to any orientation . Generally, the integrated docking station 300 comprises a housing 302 that provides structural support for a laser section 320 , an interferometer section 325, and Processing section 330 to identify unknown constituents of a target analyte . In one embodiment , the integrated docking station 300 uses the principles of Spatial Heterodyne Spectroscopy ( SHS ) to analyze the analyte based on a Raman spectrum . Spectroscopy, in general , is based on the interaction of light with a material that induces molecular vibrations that result in a light emission, for example , ranging from ~ 660nm to ~980nm.

[ 0040 ] The integrated docking station 300 has a compact , light-weight design . For example , in one configuration, the integrated docking station 300 has a maximum weight of about 6 lbs . and is about 5 inches high x 8 inches wide x 14 inches long . This is j ust one example of the weight and dimensions of the integrated docking station 300 , and in other embodiments , these dimensions may either be greater or less than those noted above . Though compact and lightweight , this design can analyze a Raman spectrum and provide qualitative or quantitative analytical data of a targeted analyte in a fluid sample, such as a biofluid sample .

[ 0041 ] In such a compact design, several aspects that can affect device performance are considered . One such aspect is the thermal gradient that will be generated by the laser and processing control boards located within the housing 302 . I f the thermal gradient is not properly managed, it may negatively affect the optical components or laser' s performance . Another aspect that is considered is that of electromagnetic interference regarding the optics within the housing 302 . Also, vibrational noise is addressed . It is beneficial to have materials within the integrated docking station 300 to help dampen any vibrational noise occurring within the housing 302 that can cause misalignment of the photodetector and affect accuracy .

[ 0042 ] In one aspect , the integrated docking station 300 is thermally strati fied . The integrated docking station 300 is integrated in that the components needed to analyze spectrum, such as Raman spectrum from a test sample are contained within a portable housing . It is thermally stratified because the components and thermal baf fle plates within the integrated docking station 300 are arranged to minimi ze heat flow through optical components of the interferometer section 325 . Though the illustrated embodiment has three sections 320 , 325 and 330 , other embodiments may comprise fewer or more sections . Due to its relatively compact size , these sections are arranged to efficiently balance the thermal gradient across the integrated docking station 300 and provide physical separation required to limit the thermal impact on the performance and behavior of the optics of the interferometer section 325.

[ 0043 ] The housing 302 comprises a thermally conductive top plate 305 and a thermally conductive bottom plate 310 . The side walls 315 may also be constructed from a thermally conductive material , such as a thermally conductive metal , which in one embodiment may be anodized aluminum or thermally conductive plastics . A laser section 320 , an embodiment of which is seen in FIG . 3B, contains a laser, laser driver, a microcontroller, a laser shutter, and laser thermal management components , such as one or more heat sinks or thermal electric cooler ( s ) , for example a Peltier Cooler . In one embodiment, the laser operates at a wavelength ranging from approximately 660nm to approximately 785nm . As seen in the embodiment of FIG . 3B, the heat generating components are mounted to the thermally conductive top plate 305 , which in one embodiment may have external fins (not shown) to improve thermal dissipation . Also, the heat generating components may be of fset from the inner surface of the thermally conductive top plate 305 with thermally conductive pucks comprised of a thermally conductive material , such as copper or thermal grease . Additionally, in some embodiments the laser section 320 also contains a microcontroller that, among other things , controls sensors , the thermal electric cooler ( s ) , and the laser, along with providing trigger timing for the image sensor . An optional fiber spool may also be present in the laser section 320 for optical fiber management .

[ 0044 ] One embodiment of the integrated docking station 300 includes a laser interlock system that prevents the laser from turning on until a collector is optically coupled to the integrated docking station 300 . As discussed below, a microcontroller located in either the laser section 320 or other sections , as discussed below, will include programming and circuitry that are electrically coupled to a switch and activates the laser only when the photonic chip assembly 115 is optically coupled to the integrated docking station 300 . [ 0045 ] An interferometer section 325, an embodiment of which is schematically shown in FIG . 3C contains the optical components that make up an interferometer, as discussed in more detail below . Among other features , interferometer section 325 has a fixed and cushioned optic positioning posts on which to mount the optical components , and a camera mount . As explained below, the photodetector is adj ustable . However, the optical components comprising the interferometer are fixed . As used herein and in the claims , " fixed" means that their positions are not mechanically adj ustable relative to the housing 302 . For example , their positions cannot be changed by turning a set screw or otherwise mechanically moving them .

[ 0046 ] A processing section 330 , additional embodiments of which are schematically shown in FIG . 3D, contains one or more microprocessors located on one or more ( PCBs ) that are programmed to process data received from the photodetector . The processing section 330 may also include memory for storing a digital library of Raman spectrum of various biological or chemical molecules . Additionally, the microprocessor ( s ) control ( s ) the overall operation of the integrated docking station 300 . For example, it may use algorithms to transform the signals received from the photodetector into spectral data . As such, the microprocessor ( s ) work in conj unction with the interferometer to provide a spectrometer for processing spectral data . Additionally, the microprocessor ( s ) may send command signal ( s ) to the microcontroller in the laser section 325 to execute commands related to the laser, thermal management components , the laser shutter, and the power management components and cooling fans located in the processing section 325. Processing section 320 includes a grounded power supply, or optional batteries , cooling fans , and various known electrical interfaces , such as USB ports , ether net ports , or an antenna for wireless transmission used for connecting the integrated docking station 300 to peripheral components , such as a computer, smart phone, or cloud servers . [ 0047 ] In one embodiment, the interferometer section 325 is separated from the laser section 320 by a first thermal baffle plate 335 and is separated from the processing section 330 by a second thermal baffle plate 335' . Thermal baf fle plates 335 , 335 ' conduct thermal energy from the interferometer section 325, reducing the impact of locali zed heating on the operation of the integrated docking station 300 , in general . Additionally, the thermal baf fle plates 335 , 335' can be grounded to provide impede an electromagnetic field about the optical components from the electronic components located within the laser section 320 and processing section 330 . Additionally, optional thermal isolation spacers 340 may also be positioned between the side walls 315 , on either side of the thermal baf fles plates 335 , and between the side walls 315 and the thermally conductive top plate 305 and the thermally conductive bottom plate 305 . These thermal isolation spacers 340 maybe comprised of plastic or rubber . In addition to aiding in the control of the thermal gradient across the integrated docking station 300 , they can also aid to dampen vibrations of the housing 302 . The thermally conductive top plate 305 helps to facilitate heat removal from the integrated docking station 300 and from the components contained within each section .

[ 0048 ] FIG . 3E illustrates an embodiment of the interferometer section 325 . The interferometer section 325 , in this embodiment , is an interferometer 345. In one embodiment , the interferometer' s 345 frame is formed from a billet, though in other embodiments , it may be constructed of individual structural components coupled together . In one embodiment , the interferometer section 325 is comprised of a material with a high thermal conductivity and good strength and malleability, such as aluminum or thermally conductive plastic . The interferometer 345 makes up a portion of a spectrometer system, for example a SHS spectrometer .

[ 0049 ] In the illustrated embodiment , the interferometer 345 comprises an optics end 350 and a photodetector end 355. The optics end comprises a beam splitter 350a that is centered within the optics end 350 , first and second interference gratings 350b, and one or more beam expanders 350c, all of which are commercially available . Interior surfaces of the frame of the interferometer 345 have setting grooves formed within the interior walls of the interferometer' s frame that are precisely placed, grooved, and sized to securely hold the optics of the interferometer in their fixed positions for accurate transmission of an optical signal received by the interferometer 345 . In an embodiment , the first and second interference gratings 350b have a custom dimension for optimal interference patterns in the 680nm to 980nm range with minimal distance for the interference pattern to a photodetector 355a that provide an interferometer having a resolution of about 0 . 1 ^cm-1 . The faces of the first and second interference gratings 350b are positioned at an of fset angle with respect to opposing faces of the beam splitter 350a, that is , the angle of incidence of the light received from the beam splitter 350a by the first and second gratings 350b is greater than zero degrees ( 0 ° ) , as generally shown . In one embodiment, this angle of incidence may range from 15 ° to 28 ° . An epoxy or other known adhesive may be used to further secure the optical components in their respective setting grooves . As such, the optical components are fixed, as discussed above . Also, they may be positioned on alignment pedestals (not shown) . An optical signal is received into the optics end 350 through optical port 350d .

[ 0050 ] In one embodiment , Spatial Heterodyne Spectroscopy ( SHS ) is implemented in the analytical process . SHS is a more recent Fourier-trans form spectroscopic technique capable of very high spectral resolution and uses a modified Mach-Zehnder interferometer in which the mirrors in each arm are replaced by interference gratings that create interference patterns that are received by the photodetector 355a . SHS is very suitable for high spectral resolution, narrow spectral band applications .

[ 0051 ] A cylindrical lens 360 is positioned between the optics end 350 and photodetector end 355 and is positioned such that its focal length focuses the optical signal on the photodetector 355a, for example a charge couple device (CCD) collector array, located in the photodetector end 355. In one aspect , the CCD has 140 , 000 pixels , and positions of the beam splitter 350a and the first and second interference gratings 350b, the cylindrical lens and CCD provide an interferometer having a resolution of 0 . 1 ^cm-1 . The cylindrical lens 360 is also received within setting grooves for fixed and proper optical alignment . The interferometer section 325 also includes an optical interface 370 that receives an external signal and provides an optical coupling point for the laser .

[ 0052 ] The interferometer 345 forms an integral part of the integrated docking station 300 . An optical interface 370 , as described in more detail below, is configured to receive an external signal from the photonic chip assembly 115 and optically couple the photonic chip assembly 115 to the integrated docking station 300 , as shown in FIG . 1A. In this embodiment, an input fiber 380 , such as a known optical glass , cladded fiber, extends from the optical interface 370 to the laser located in the laser section (not shown in this view) , which transmits light into the waveguide of the photonic chip assembly 115. An output fiber 385, of like composition to input fiber 380 , extends from the optical interface 370 to the interferometer 345 , as generally shown . This configuration forms an "open" optical path, which is completed or closed when the photonic chip assembly 115 is plugged into the optical interface 370 . Additionally, the photodetector end 355 may also include an adj ustable photodetector mounting plate , details of which are discussed below, that allows the position of the photodetector 355a to be adj usted . Thus , if slight misalignment occurs , the photodetector 355a can be adj usted to move the photodetector 355a back into proper alignment . This optional feature can be particularly beneficial , given that the optics are fixed and are not freely moveable for adj ustment .

[ 0053 ] FIG . 3F illustrates a sectional view of an embodiment of the optical interface 370 . This embodiment comprises a housing 370a, into which the input and outputs of the photonic chip assembly 115 may be inserted . The housing 370a is securely attached to the interior of the integrated docking station 300 . Within housing 370a is a ferrule connector retainer 370b that retains optical input and output ports 370c, such as connector ferrules , that receive the coupling ends of input fiber 380 and output fiber 385 . The optical input and output ports 370c optically align with the optical connectors of the photonic chip assembly 115 when it is inserted into the housing 370a . Springs 370d that are held with the housing 370a by spring retainers 370e provide a biasing force against the optical input and output ports 370c when the photonic chip assembly 115 is inserted into the housing 370a to provide good optical coupling . The ferrule connector retainer 370b is held in the housing 370a by a retainer plate 370f and screws 370g .

[ 0054 ] FIG . 3G illustrates an embodiment of an adj ustable mounting plate 375 that allows the photodetector 355a to be adj usted with respect to the optics of the interferometer 345. In the illustrated embodiment , the adj ustable mounting plate 375 comprises spring-loaded pins 375a that exert a biasing force against a movable adj ustment plate 375b that secures the photodetector 355a to the integrated docking station 300 . Adj ustable set screws 375c oppose each of the spring-loaded pins 375a, as generally seen in FIG . 3G . The movable adj ustment plate 375b is secured to the integrated docking station 300 by fastening screws 375d . When the misalignment of the photodetector 355a occurs within the interferometer 345 for some reason, the fastening screws 375d are loosened . The set screws can be used to move the movable adj ustment plate 375b against the respective spring-loaded pins 375a until the photodetector 355a achieves proper alignment with the optical components of the interferometer 345. Once proper alignment is achieved the fastening screws 375d can be tightened to hold the photodetector 355a in its re-aligned position .

[ 0055 ] FIG . 4 illustrates a schematic view of another embodiment of an integrated docking station 400 . In this embodiment , integrated docking station 400 is arranged in a two- sectioned ( laser/ interf erometer section and an electrical section) configuration, but includes many of the same components , as discussed above as related to the embodiments illustrated in FIGs . 3A-3G . The arrangement of these sections and associated components are designed to minimi ze the ef fects of locali zed thermal generation, and provide physical separation required to limit the thermal impact on the performance and behavior of the optics . Moreover, the various heating generating components are preferably arranged to reduce the thermal gradient across the integrated docking station 400 .

[ 0056 ] Reference is made with respect to the embodiment of an integrated docking station 400 illustrated in FIG . 4A, which for purposes of discussion, is hori zontally oriented and in which the sections are stacked in a vertical fashion . The integrated docking station 400 uses the principles of spectrometry, for example SHS , as discussed above , to analyze a target analyte using a spectrum, such as a Raman . Generally, the integrated docking station 400 provides the structures to support the operation of a laser, an interf erometer/ spectrometer and power circuitry, as needed, to stabili ze and tune the laser to the above-noted wavelength range and calibrate and process the results of the spectrometer to analyze a range of substances for target analytes . In the illustrated embodiment , the integrated docking station 400 comprises two sections , a laser/interf erometer section 420 and an electrical section 425 . in this embodiment, the laser section 420 comprises a laser, an interferometer, and photodetector ( for example a CCD camera ) .

[ 0057 ] As with the previously described embodiments , the integrated docking station 400 has a compact, light-weight design and the thermal gradient and vibrational considerations discussed above are also applicable in this embodiment . [ 0058 ] The integrated docking station 400 has a thermally conductive top plate 405 and thermally conductive bottom plate 410 . Side walls 415 may also be constructed from a thermally conductive material , such as metal , which in one embodiment may be anodi zed aluminum . The thermally conductive top plate 405, overlays the laser/ interf erometer section 420 that houses the laser, laser thermal management components , such as known heatsinks or thermal electric coolers ( TE coolers , e . g . , Peltier Cooler) , and the interferometer, as discussed above regarding FIG . 3E . In one embodiment , the laser is tuned to operate from ~ 660nm to ~980nm . The heat generating components in laser/interf erometer section 420 are thermally coupled or mounted to the thermally conductive top plate 405 , which in one embodiment , may include external fins (not shown) to improve thermal dissipation . One or more TE coolers may be placed in contact with the laser, for example one on top and one on the bottom of the laser, to provide added heat removing capacity, since in this configuration, the laser occupies the same level as the interferometer .

[ 0059 ] The heat generating components may also be of fset from the inner surface of the thermally conductive top plate 405 with thermally conductive pucks comprised of a thermally conductive material , such as copper or thermal grease . As mentioned above regarding other embodiments , the integrated docking station 400 includes a laser interlock system that prevents the laser from turning on until a collector, as those described above , is inserted into the integrated docking station 400 for analysis , which closed or completes the optical path .

[ 0060 ] The electrical components , such as a main microprocess , control boards , power supply, microcontroller, and cooling fans are all located in the electrical section . In one embodiment the microprocessor includes programming that controls the microcontroller that executes a switch mechanism that activates the laser only when the collector and/or adapter is inserted into the integrated docking station 400 . The electrical section 425 houses the microprocessor for processing spectral data received from the photodetector and, in one embodiment , storing a reference library of spectrum data, and carrier board for supporting interface components , such as USB ports , ethernet , etc . , and power connections and a primary power on/off switch . In other embodiments , the microprocessor may be on an external component, such as an external computer connected to the integrated docking station 400 . In such embodiments , the electronics section 425 is a power section that houses power supply and external communication components . The electronics section 425 is vented, and one or more fans provide airflow through it . An optional battery may also be contained with the processing/power section 425 . The thermally conductive bottom plate 410 provides a path of thermal radiation away from the integrated docking station 400 .

[ 0061 ] The laser/interf erometer and electronic sections 420 ,

420b of the integrated docking station 400 are separated by a thermal baf fle plate 425 to conduct thermal energy, reducing the impact of locali zed heating on the operation of the integrated docking station 400 . This thermal baffle plate 435 also provides for controlled placement and vibrational dampening of the optical components . Additionally, optional thermal isolation spacers 440 may also be positioned between the side walls 415 and the thermal baf fle plate 435 and the thermally conductive top plate 405 and bottom plate 410 . These thermal isolation spacers 440 maybe comprised of plastic or rubber . In addition to aiding in the control of the thermal gradient across the integrated docking station 400 , they can also provide vibration isolation . The thermally conductive top plate 405 helps to facilitate heat removal from the integrated docking station 400 and from the components contained within each section .

[ 0062 ] FIG . 4B shows another layout configuration of the embodiment of FIG . 4A. In this embodiment , the interferometer 345 is isolated from the electronics section 450 and the laser section 460 by a thermal baffle plate 470 , all of which may include the various components as discussed regarding other embodiments .

[ 0063 ] FIG . 5 illustrates a schematic block layout of one embodiment of the interior components of the integrated docking station 105 and collector 110 , which is this embodiment is a test card that includes the photonic chip assembly 115, as discussed above . In the illustrated embodiment, the integrated docking station 105 comprises a housing, indicated by the dashed line , embodiments of which are described above . Contained within the integrated docking station 105 are several components . In the illustrated embodiment , the integrated docking station comprises , the optical interface 505 , as discussed above, a light source , such as a laser, a laser driver and sensor, a communications chip that is connected to an antenna 510 for wireless transmission of data, a DPF Driver and Sensor, a Data Processor, an interferometer Driver and Sensor that are coupled to an Interferometer, such as the one discussed above and a power supply, all of which are operatively connected to a PCB interface and controller .

[ 0064 ] The data processor when combined with optical data received from the interferometer 345 forms a spectrometer . When the optical signal is received from the waveguide located in the photonic chip assembly 115 and is propagated through the interferometer onto the photodetector that converts the optical signal to an electrical signal and then transmits the electronic signal to the data processor . The data processor uses a Fast Fourier Transform ( FFT ) algorithm to convert the interference patten into a spectrum, which can then be converted by the data processor into a Raman spectrum . As used herein and in the claims , operatively coupled means that the components are coupled, either optically, electrically, or wirelessly, or a combination thereof to provide an operative unit for obtaining and analyzing data and providing and/or transmitting test results . As previously, mentioned the waveguide of the photonic chip assembly 115 within the collector 110 is optically coupled to the optical components , the laser and interferometer 345 , of the integrated docking station 105, as explained above .

[ 0065 ] The photonic circuit of the photonic chip assembly 115, the interferometer, and the FFT spectrometer circuit generate an output spectrum by modulating the radiation in the time domain through an interference pattern, which then undergoes a Fourier trans formation, as mentioned above . This interference pattern ( Interferogram) represents a modulated radiation signal . In the interferometric photonic circuit , the analog signal is recorded at the photodetector, which encodes the wavelength or the wave number information of the encoded Raman spectrum. A Fourier- trans form routine is then performed on the interferogram to recover a Raman spectrum . An advantage of this system is the photonic integrated circuit and stabili zed optical source .

[ 0066 ] As mentioned above, one embodiment of this disclosure uses the principles of Raman spectroscopy . Raman spectroscopy is a technique in which incident laser light is inelastically scattered from a sample and shi fted in frequency by the energy of its characteristic molecular vibrations . The Raman spectrum provides high informational content on the chemical structure of the probed substances , which makes this method an ideal tool for the identification of pathogens , illicit drugs , pharmaceutical and drug manufacturing monitoring/ validation or alcohol detection and identification . However, unlike known process that focus the Raman beam on a single point on a surface containing a targeted subj ect matter, the embodiments of this disclosure provide a structure that collects data along at least a portion of the length of the waveguide , greatly enhancing the quantity and accuracy of the data .

[ 0067 ] In practice, the test fluid is placed onto the photonic chip assembly 115 , providing confinement of the molecules under test . This confinement ensures the greatest overlap of the molecules with the probe beam . Further, it provides intimate and strong interaction of the molecules with nanostructures along the walls of the waveguide, which provides enhanced Raman Signal strength over known devices and processes .

[ 0068 ] The application of Surface-enhanced Raman spectroscopy ( SERS ) , to improve signal strength is a modification of Raman spectroscopy . It has been demonstrated as a very capable approach to identi fy biomolecules , such as a bacterium or viruses . It is based on the enhancement of the Raman scattering signal of certain molecules when they are adsorbed or placed in the proximity of appropriate metallic nanostructures , usually noble metals such as silver, gold, or copper . It has been shown that the SERS approach can yield enhancement factors as large as 10 ¹⁴ - 10 ¹⁵ , leading to Raman scattering cross sections larger than those of fluorescent organic dyes or other reagents used in modern test sets or detection panels .

[ 0069 ] The detection and identification of di f ferent toxicological drugs is insured by the ability to integrate 5 elements into a small area, such as the illustrated integrated docking station by leveraging semiconductor manufacturing and packaging techniques . These include : l ) the stabili zed narrow band optical source to provide a controllable Raman Probe ; 2 ) the evanescently coupled low index contrast waveguides providing controlled overlap of the modal energy traveling external to the waveguide and the metallic nanostructures which provide the photonic enhancement of the Raman Scattering; 3 ) Formation of nano structures between and on the waveguides providing a controlled surface region for characteri zation of the target analyte ( drug) ; 4 ) The Integration of microfluidic volume within the photonic chip assembly 115 to confine the sample volume relative to the waveguides and enrichment structures ; 5 ) The ability to integrate a small Fourier trans form spectrometer .

[ 0070 ] Embodiments disclosed herein comprise :

[ 0071 ] One aspect of this disclosure is directed to an integrated docking station . In this aspect , the integrated docking station comprises , a housing having a top plate, a bottom plate and side walls and first and second thermal baffle plates located between the top plate and the bottom plate . A laser section is located within the housing that comprises a laser . An optical interface is attached to the housing having an optical input port and an optical output port . An interferometer section is located within the housing having an optics end and a photodetector end . The interferometer comprises beam expanders , first and second interference gratings , a beam splitter, and a cylindrical lens in fixed positioned in the optics end . The photodetector end comprises a photodetector coupled to an adj ustable mounting plate and positioned in the photodetector end to receive light from the optics end through the cylindrical lens . A processing section is located within the housing and comprises a microprocessor for processing spectral data and a power supply . The interferometer section is positioned between the laser section and the processing section, and the first thermal baf fle plate is located between the interferometer section and the laser section, and the second thermal baf fle plate is located between the interferometer section and the processing section .

[ 0072 ] Another aspect provides an analytical system . This aspect comprises a collector having a body with an interior volume for holding a biofluid therein . The body has an open end through which a biofluid is received into the body and a base located opposite the open end . The base has a fluid port that is positioned to allow a fluid flow from the body into the docking cavity . A photonic chip assembly is located within the docking cavity of the base . In one aspect , the photonic chip assembly comprises a silicon substrate, a photonic chip comprising a planar waveguide formed on the silicon substrate and having input and output ends extending therefrom. The input and output optical fibers are located on the silicon substrate and within v-grooves formed in the silicon substrate that have coupling ends that optically align with the input and output ends of the planar waveguide, respectively . Optical connectors having a coupling end are located at an end of the silicon substrate . The input and output optical fibers extend into the optical connectors and terminate at the coupling end of the optical connectors . An integrated docking station is also included . The integrated docking station comprises , a housing having a top plate, a bottom plate and side walls and first and second thermal baffle plates located between the top plate and the bottom plate . A laser section is located within the housing that comprises a laser . An optical interface is attached to the housing having an optical input port and an optical output port . An interferometer section is located within the housing having an optics end and a photodetector end . The interferometer comprises beam expanders , first and second interference gratings , a beam splitter, and a cylindrical lens in fixed positioned in the optics end . The photodetector end comprises a photodetector coupled to an adj ustable mounting plate and positioned in the photodetector end to receive light from the optics end through the cylindrical lens . A processing section is located within the housing and comprises a microprocessor for processing spectral data and a power supply . The interferometer section is positioned between the laser section and the processing section, and the first thermal baf fle plate is located between the interferometer section and the laser section, and the second thermal baf fle plate is located between the interferometer section and the processing section .

[ 0073 ] Another aspect of this disclosure presents an integrated docking station comprising, a housing having a top plate , a bottom plate and side walls and first and second thermal baf fle plates located between the top plate and the bottom plate . A laser/interf erometer section is located within the housing . The laser/interf erometer section comprises , a laser having a thermal electric cooler attached thereto , an optical interface attached to the housing having an optical input port and an optical output port, and an interferometer having an optics end and a photodetector end . The interferometer comprises , beam expanders , first and second interference gratings , a beam splitter, and a cylindrical lens in fixed positioned in the optics end and a photodetector end comprising a photodetector coupled to an adj ustable mounting plate and positioned in the photodetector end to receive light from the optics end through the cylindrical lens . The integrated docking station further comprises an electronics section located within the housing . The electronics section comprises , a microprocessor for processing spectral data and controlling the laser, and a power supply, wherein the laser/interf erometer section is separated from the electronics section by a thermal baf fler plate .

[ 0074 ] Element 1 : wherein the first thermal baffle plate and second thermal baf fle plate are grounded to impede an electromagnetic field about the interferometer section .

[ 0075 ] Element 2 : further comprising thermal isolation spacers located between the side walls of the housing, wherein the thermal isolation spacers also serve to dampen vibrations within the housing . [0076] Element 3: wherein the optical interface is configured to receive an input end and an output end of a photonic chip assembly therein.

[0077] Element 4: wherein the optical interface is an open optical path, wherein the optical path is closed upon insertion of the photonic chip assembly into the optical interface.

[0078] Element 5: wherein the optical interface comprises: a housing that is attachable to the housing of the integrated docking station; a ferrule connector that retains connector ferrules therein to receive coupling ends of an input fiber and output fiber; and springs held with the housing by spring retainers configured to provide a biasing force against the connector ferrules.

[0079] Element 6: further comprising an adjustable mounting plate couplable to the photodetector to allow adjustment of the photodetector with respect to the optics end of the interferometer, the adjustable mounting plate comprising a movable adjustment plate, spring-loaded pins that exert a biasing force against the movable adjusting plate and that secures the photodetector to the integrated docking station, and adjustable set screws that oppose each of the spring-loaded pins.

[0080] Element 7: wherein the photodetector is a charge couple device (CCD) collector array that has 140,000 pixels.

[0081] Element 8: wherein the fixed positions of the beam expanders, beam splitter, first and second interference gratings, cylindrical lens, and the CCD collector array provides an interferometer having a resolution of 0.1 ^cm-1 .

[0082] Element 9: wherein the laser section further comprising a microcontroller for controlling an operation of the laser and a thermal electric cooler attached to the laser.

[0083] Element 10: wherein the laser section and interferometer section are located in a laser/ interferometer section and the thermal baffle plate separates the laser/interf erometer section from the electronics section.

[0084] Element 11: wherein the thermal baffle plate is grounded to impede an electromagnetic generated by the electronics section about the laser/interf erometer section.

[0085] Element 12: further comprising a microcontroller located in the electronics section that is programmed to receive command signals from the microprocessor for laser operation.

[0086] Although the present disclosure has been described in detail, those skilled in the art should understand that they can make various changes, substitutions, and alterations herein without departing from the spirit and scope of the disclosure in its broadest form.