Title:
INTEGRATED ENDPOINT DETECTION SYSTEM WITH OPTICAL AND EDDY CURRENT MONITORING
Document Type and Number:
WIPO Patent Application WO2002087825
Kind Code:
A8
Abstract:
A chemical mechanical polishing apparatus (20) and method can use an eddy current monitoring system (40) and an optical monitoring system (140). Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad (30) can be calculated. The eddy current monitoring system (40) and optical monitoring system (140) can measure substantially the same location on the substrate.
Inventors:
SWEDEK BOGUSLAW A
BIRANG MANOOCHER
JOHANSSON NILS
BIRANG MANOOCHER
JOHANSSON NILS
Application Number:
PCT/US2002/014281
Publication Date:
September 30, 2004
Filing Date:
May 02, 2002
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
International Classes:
B24B37/04; B24B49/02; B24B49/10; B24B49/12; B24B37/005; G01B11/06; H01L21/304; (IPC1-7): B24B37/04; B24B49/02; B24B49/10; B24B49/12
Download PDF:
Previous Patent: PEELING APPARATUS WITH ENHANCED ABRASIVE ROLLERS AND ASSOCIATED METHODS
Next Patent: CLAMPING DEVICE
Next Patent: CLAMPING DEVICE