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Patent Searching and Data


Title:
INTEGRATED EQUIPMENT OF IMPLANT HEADS AND WELD HEADS AND METHOD OF IMPLANTING AND WELDING WIRES
Document Type and Number:
WIPO Patent Application WO/2009/000167
Kind Code:
A1
Abstract:
An equipment for manufacturing smart cards integrates implant heads (7) and weld heads (8). The equipment includes a housing (9), a stage (10) and a drive system for implant heads (7) and weld heads (8). The direction of cards processing is defined as X-axis direction. The number of implant heads (7) is equal to the number of weld heads (8). The implant heads (7) implant wires simultaneously and the weld heads (8) perform welding simultaneously during the processing. Since the implant heads and the weld heads are arranged in appropriate positions of the drive system in advance, after wires are implanted, the drive system moves a distance less than 60% of the space between two cards along the X-axis direction so that the weld heads (8) may arrive at the welding position and perform welding.

Inventors:
ZHANG, Xiaodong (Bldg 40, BDA International Business ParkNo. 2. Jingyuan North Street, Economic-Technological Development Area, Beijing 6, 100176, CN)
Application Number:
CN2008/070380
Publication Date:
December 31, 2008
Filing Date:
February 29, 2008
Export Citation:
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Assignee:
BEIJING GOLDEN SPRING TECHNOLOGY DEVELOPMENT CO., LTD. (Bldg.40, BDA International Business ParkNo.2. Jingyuan North Street, Economic-Technological Development Area, Beijing 6, 100176, CN)
北京德鑫泉科技发展有限公司 (中国北京市经济技术开发区景园北街2号BDA国际企业大道40号楼, Beijing 6, 100176, CN)
International Classes:
B23Q15/00; B25J9/02; B25J9/12; G06K19/07; H05K3/34; B23Q15/00; B25J9/02; B25J9/12; G06K19/07; H05K3/34
Attorney, Agent or Firm:
BEIJING SHUANG SHOU INTELLECTUAL PROPERTY AGENT LTD. (1-102 Apartment 3, Huangtingzi Huayuanlu, Haidian District, Beijing 8, 100088, CN)
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