Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
INTEGRATED MICRO LED CHIP AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/121238
Kind Code:
A1
Abstract:
An integrated Micro LED chip and a manufacturing method therefor. The method comprises: growing an epitaxial wafer on a substrate layer, the epitaxial wafer comprising a blue light epitaxial layer and a green light epitaxial layer (S1); processing a first blue light pixel, a second blue light pixel and a green light pixel in a preset mode on the epitaxial wafer (S2); etching the second blue light pixel with a color conversion filling hole (S3); filling the color conversion filling hole with a color conversion material to obtain a red light pixel (S4); and packaging the first blue light pixel, the red light pixel and the green light pixel to generate a Micro LED chip (S5). By growing bicolor epitaxial layers on a substrate layer, and in cooperation of a color conversion material, RGB tri-color display is achieved, and the RGB tri-color display is achieved on one chip substrate, integration of a large amount of pixels can be realized without mass transfer, and the production cost is saved.

Inventors:
ZHANG FAN (CN)
WU YONGSHENG (CN)
HUANG ZHANGTING (CN)
Application Number:
PCT/CN2021/094592
Publication Date:
June 16, 2022
Filing Date:
May 19, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIAN PRIMA OPTOELECTRONICS CO LTD (CN)
International Classes:
H01L33/00; H01L33/06; H01L33/08; H01L33/12; H01L33/32
Foreign References:
CN112420885A2021-02-26
CN110880522A2020-03-13
CN110534542A2019-12-03
CN111326621A2020-06-23
US20200266233A12020-08-20
US20200083406A12020-03-12
Attorney, Agent or Firm:
BORSAM INTELLECTUAL PROPERTY (FUZHOU) (CN)
Download PDF: