Title:
INTEGRATED NEUROPROCESSOR COMPRISING THREE-DIMENSIONAL MEMORY ARRAY
Document Type and Number:
WIPO Patent Application WO/2017/162129
Kind Code:
A1
Abstract:
An integrated neuroprocessor comprising a three-dimensional memory (3D-M) array can not only perform neurocomputation, but also internally store synaptic weights required for the neurocomputation. Three-dimensional integration between the 3D-M array and a neurocomputation circuit can not only improve the unit chip area computation capability, but also greatly increase the unit chip area storage capability.
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Inventors:
ZHANG GUOBIAO (CN)
Application Number:
PCT/CN2017/077445
Publication Date:
September 28, 2017
Filing Date:
March 21, 2017
Export Citation:
Assignee:
CHENGDU HAICUN IP TECHNOLOGY LLC (CN)
International Classes:
G06N3/08; G06N3/063; H01L27/115
Foreign References:
| CN103633091A | 2014-03-12 | |||
| CN1967723A | 2007-05-23 | |||
| CN102610615A | 2012-07-25 | |||
| US20100265773A1 | 2010-10-21 |
Attorney, Agent or Firm:
CHENGDU CENTRAL ASIA PATENT AGENCY CO., LTD (CN)
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