Title:
INTEGRATED-PACKAGE DISPLAY MODULE
Document Type and Number:
WIPO Patent Application WO/2021/120386
Kind Code:
A1
Abstract:
An integrated-package display module comprises a substrate (1), driving ICs (2), and LED chips (3). The multiple driving ICs (2) are mounted on a bottom surface of the substrate (1), and the multiple LED chips (3) are mounted on a top surface of the substrate (1). The module further comprises a transparent layer (5) and a semi-transparent layer (4). The transparent layer (5) is disposed on the top surface of the substrate (1) and covers the LED chips (3). The semi-transparent layer (4) is disposed on a top surface of the transparent layer (5), and a material of the semi-transparent layer (4) is fluorine-containing organic matter. The semi-transparent layer (4) includes the fluorine-containing organic matter as a material and serves as the outermost layer. Since the fluorine-containing organic matter provides good heat resistance, hydrophobicity and insulation, the integrated-package display module can fulfill moisture-proof, dust-proof, and anti-static functions, thus preventing damage to the integrated-package display module, and extending the service life thereof.
Inventors:
LIANG MICHAEL (CN)
ZHAO RAY (CN)
ZHAO RAY (CN)
Application Number:
PCT/CN2020/076195
Publication Date:
June 24, 2021
Filing Date:
February 21, 2020
Export Citation:
Assignee:
AET DISPLAYS LTD (CN)
International Classes:
H01L33/56; H01L25/16; H01L33/58
Foreign References:
| CN103514816A | 2014-01-15 | |||
| CN109003970A | 2018-12-14 | |||
| CN103680340A | 2014-03-26 | |||
| CN106683578A | 2017-05-17 | |||
| US20150228629A1 | 2015-08-13 | |||
| JP2005136224A | 2005-05-26 |
Download PDF:
Previous Patent: INDOOR SINGLE-ARM HOISTING MACHINE
Next Patent: MATERIAL DYNAMIC MEASUREMENT METHOD AND AXIAL VIBRATION MEASUREMENT SYSTEM
Next Patent: MATERIAL DYNAMIC MEASUREMENT METHOD AND AXIAL VIBRATION MEASUREMENT SYSTEM