Title:
INTEGRATED PACKAGING OF MICROMECHANICAL SENSORS AND CONTROL CIRCUITS
Document Type and Number:
WIPO Patent Application WO2001029529
Kind Code:
A3
Abstract:
A micromechanical sensor (42) is fabricated on a first semiconductor wafer (40), and a control circuit is fabricated on a front side of a second wafer (30). A cavity (36) is formed on the backside of the second wafer, the cavity is being formed such that the sensor on the wafer fits within the cavity when the wafers are brought together in an adjoining relationship. Through-holes (34) are etched through the backside of the second wafer to allow access to electrical points and a patterned layer (38) is deposited to form electrical interconnections between electrical contact points and terminal points on the backside of the wafer via through-holes. The two wafers are cleaned and bonded together. The bonded wafers are diced to yield individual bonded sensor-control circuit pairs.
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Inventors:
MARINIS THOMAS F
SOHN JEROME B
TUMMINELLI RICHARD P
SOHN JEROME B
TUMMINELLI RICHARD P
Application Number:
PCT/US2000/041193
Publication Date:
September 13, 2001
Filing Date:
October 17, 2000
Export Citation:
Assignee:
DRAPER LAB CHARLES S (US)
International Classes:
B81B7/00; G01P1/02; G01P15/08; (IPC1-7): H01L21/302; H01L21/48; H01L21/52; H01L21/60; H01L21/70; H01L29/84; H01L23/02
Foreign References:
| US5837562A | 1998-11-17 | |||
| US6114221A | 2000-09-05 | |||
| US5866469A | 1999-02-02 | |||
| US5492596A | 1996-02-20 | |||
| US5646072A | 1997-07-08 | |||
| US5721162A | 1998-02-24 | |||
| US5895233A | 1999-04-20 | |||
| US6143583A | 2000-11-07 | |||
| US6074891A | 2000-06-13 |
Other References:
See also references of EP 1234326A4
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