Title:
INTEGRATED PLATING AND PLANARIZATION PROCESS AND APPARATUS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2004/046426
Kind Code:
A1
Abstract:
A method and apparatus are described for performing both electroplating of a metal layer and CMP planarization of the layer on a substrate. The apparatus includes a table (10) supporting a polishing pad (20); the table and pad have a plurality of holes (210, 220) forming channels for dispensing an electroplating solution onto the pad. Electroplating anodes (201, 202, 203) are disposed in the channels and in contact with the electroplating solution. A carrier (12) holds the substrate (1) substantially parallel to the top surface of the pad (20) and applies variable mechanical force on the substrate against the pad, so that the spacing between substrate and pad may be less during electroplating than during electroetching.
Inventors:
ECONOMIKOS LAERTIS
DELIGIANNI HARIKLIA
COTTE JOHN M
GRABARZ HENRY J
CHEN BOMY
DELIGIANNI HARIKLIA
COTTE JOHN M
GRABARZ HENRY J
CHEN BOMY
Application Number:
PCT/US2003/036208
Publication Date:
June 03, 2004
Filing Date:
November 14, 2003
Export Citation:
Assignee:
IBM (US)
International Classes:
C25D5/48; C25D7/12; H01L21/288; H01L21/321; H01L21/768; (IPC1-7): C25D5/22; C25D5/48; C25D17/00
Foreign References:
| US5911619A | 1999-06-15 | |||
| US6004880A | 1999-12-21 | |||
| US6328872B1 | 2001-12-11 | |||
| US6454916B1 | 2002-09-24 | |||
| US6478936B1 | 2002-11-12 | |||
| US6270646B1 | 2001-08-07 |
Other References:
See also references of EP 1560949A4
Attorney, Agent or Firm:
Anderson, Jay H. (Zip 482 2070 Route 5, Hopewell Junction NY, US)
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