Technical Field The present invention relates to an improvement of the prior ail (which is disclosed in Korean Patent Registration No. 312739 entitled "Integrated Silicone Contactor (ISC) having Conductor Built therein") as previously filed by the same applicant as the present invention, and more particularly, to an integrated silicone contactor in which instead of a "rigid" electric conductor mounted on the top and bottom surfaces of a conductive silicone part, a "pliable" conductive reinforcing layer made of the same material as that of the conductive silicone part is formed on the top and bottom surfaces of the conductive silicone part, the conductive reinforcing layer containing mixed conductive powder having a higher density than that of conductive powder contained in the conductive silicone part so as to improve conductivity of the conductive reinforcing layer.

Background Art

Among conventional prior arts as previously filed and registered by the same applicant as the present invention, there is disclosed Korean Patent Registration No. 278989 entitled "Ring-type Contact Pad for Integrated Silicone Contactor". Such a patent will be described hereinafter with reference to FIG.1.

FIG.l is a cross-sectional view showing an integrated silicone contactor employed in the prior art as previously filed and registered by the same applicant as the present invention.

Referring to FIGl, an integrated silicone contractor 20 includes a plurality of conductive silicone parts 8 formed at a region which are in close contact with a plurality of ball leads 4 of a ball grid array (BGA) type semiconductor device 2, and a plurality of insulation silicone parts 6 formed at a region which are not in close contact with the ball leads 4 of the BGA type semiconductor device 2 in such a fashion that each insulation silicone part is interposed between two adjacent insulation silicone parts to support the conductive silicone part 8 so as to serve as an insulation layer. A ring-type conductor 7 is mounted on the top surface of each conductive silicone part 8 for electrically connecting each contact pad 10 of a socket board 12 on which the semiconductor device 2 is to be tested with each ball lead 4 of the semiconductor device 2.

The structure of the integrated silicone contactor is efficient for a semiconductor testing system in which a number of semiconductor devices are pressed downwardly so as to establish the electric contact between the semiconductor devices and the test socket board. Further, since each conductive silicone part is pressed independently, it becomes easy to cope with flatness of peripheral devices, and hence the characteristics of the entire testing system is improved. In addition, the integrated silicone contactor is characterized in that when the conductive silicone part positioned inside a metal ring is pressed downwardly by the lead terminals of the semiconductor device, it is prevented from being widened and its displacement is minimized, thereby extending the lifespan of the silicone contactor.

In the meantime, in order to improve the above-mentioned technique, the present applicant has developed a integrated silicone contactor structure in which a conductor 22 is mounted on the top and bottom surfaces of each conductive silicone part 8 for electrically connecting each contact pad 10 of a socket board 12 on which the

semiconductor device 2 is to be tested with each lead terminal 4 of the semiconductor device 2 using various methods such as plating, etching, coating, etc., as shown in FIGs. 2 and 3. The conductor 22, i.e., a conductive material, as shown in FIG. 4, may be fabricated in a plate spring, disc, ring or hole shape. In this manner, the conductor is mounted on the top and bottom surfaces of the conductive silicone part so that such a silicone contactor structure can relatively improve conductive effect as compared to the conventional prior art as originally filed by the present applicant. Moreover, various types of conductors are mounted on the top and bottom surfaces of the conductive silicone part so that the bottom end portion of the silicone contactor is prevented from being slid.

However, in the above-mentioned structure, since a "rigid" conductor 22 is mounted on the top and bottom surfaces of the finished conductive silicone part using various methods such as plating, etching, coating, etc., a contact portion of the conductive silicone part is relatively deteriorated in elasticity as compared to that of a silicone part in which a conductor does not exist. Therefore, this attenuates the advantage of the integrated silicone contactor aimed at allowing the terminals of the semiconductor device to come into elastic contact with the pads of the test board. Besides, owing to the frequent contact between the terminals of the semiconductor device or the pads of the test board and the rigid conductor, the plating, etching and coating surface of the rigid conductor and the terminals of the semiconductor device or the pads of the test board are damaged and foreign substances enter the contact surface therebetween.

Disclosure of Invention

Technical Problem

Therefore, in order to address and overcome the above-mentioned problems occurring in the conventional prior arts, the present inventor has invented an integrated silicone contactor in which instead of a "rigid" electric conductor mounted on the top and bottom surfaces of a conventional conductive silicone part, a "pliable" conductive reinforcing layer made of the same material as that of the conductive silicone part is formed on the top and bottom surfaces of the conductive silicone part, the conductive reinforcing layer containing mixed conductive powder having a higher density than that of conductive powder contained in the conductive silicone part so as to improve conductivity of the conductive reinforcing layer.

Technical Solution

To achieve the above objects, according to the present invention, there is provided an integrated silicone contractor comprising: a plurality of conductive silicone parts formed at a region which are in close contact with a plurality of ball leads of a ball grid array (BGA) type semiconductor device, the conductive silicone parts being made by mixing conductive metal powder with silicone; and a plurality of insulation silicone parts formed at a region which are not in close contact with the ball leads of the BGA type semiconductor device in such a fashion that each insulation silicone part is interposed between two adjacent insulation silicone parts to support the conductive silicone part, the insulation silicone parts serving as an insulation layer,

wherein the conductive silicone part is formed on the top surface or/and the bottom surface thereof with a conductive reinforcing layer containing conductive powder having a higher density than that of conductive powder contained in the conductive silicone part so as to improve conductivity of the conductive reinforcing layer.

Preferably, the density of the conductive powder contained in the conductive reinforcing layer may be more than five times that of the conductive powder contained in the conductive silicone part.

Advantageous Effects

According to the present invention, since the inventive pliable conductive reinforcing layer is formed on the top or bottom surface of the conducive silicone part, it is improved in elasticity and pliability upon the contact between the terminals of the semiconductor device or the pads of the test board and the conductive reinforcing layer, as compared to a separate rigid conductor adhered to an existing silicone contactor. Accordingly, the contacting portion of the conductive reinforcing layer and the terminals of the semiconductor device or the test board are not damaged and its conductivity is improved. Furthermore, foreign substances are prevented from entering the contact surface between the conductive reinforcing layer and the terminals of the semiconductor device or the pads of the test board, thereby lengthening the lifespan of the integrated silicone contactor.

Description of Drawings

FIGl is a cross-sectional view showing an integrated silicone contactor

employed in the prior art as previously filed and registered by the same applicant as the present invention;

FIG. 2 is a cross-sectional view showing a state where a conductor is attached to the top surface of a conventional silicone contactor according to the prior art; FIG. 3 is a cross-sectional view showing a state where a conductor is attached to the bottom surface of a conventional silicone contactor according to the prior art;

FIG. 4 is a cross-sectional view showing the conductor having various different shapes; and

FIGs. 5(a) and 5(b) are cross-sectional views showing states where a conductor is attached to the top or bottom surface of an integrated silicone contactor according to the present invention.

Best Mode for Invention

Now, an explanation on a preferred embodiment of the present invention will be in detail given with reference to attached drawings.

FIGs. 5(a) and 5(b) are cross-sectional views showing states where a conductor is attached to the top or bottom surface of an integrated silicone contactor according to the present invention.

Referring to FIGs. 5(a) and 5(b), in the present invention, there is improved the structure of the silicone contactor developed by the present applicant, the silicone contactor comprising a plurality of conductive silicone parts 8 formed at a region which are in close contact with a plurality of ball leads 4 of a ball grid array (BGA) type semiconductor device 2, the conductive silicone parts being made by mixing conductive metal powder with silicone; and a plurality of insulation silicone parts 6 formed at a

region which are not in close contact with the ball leads 4 of the BGA type semiconductor device 2 in such a fashion that each insulation silicone part is interposed between two adjacent insulation silicone parts to support the conductive silicone part 8, the insulation silicone parts serving as an insulation layer. As shown in FIGs. 5(a) and 5(b), on the top surface or/and the bottom surface of the conductive silicone part 8 is formed a conductive reinforcing layer 30, 30' containing conductive powder having a higher density than that of conductive powder contained in the conductive silicone part 8 so as to improve conductivity of the conductive reinforcing layer. The density of the conductive powder contained in the conductive reinforcing layer 30, 30' preferably is more than five times that of the conductive powder contained in the conductive silicone part 8, but is not limited thereto.

The conductive reinforcing layer 30, 30' may be formed simultaneously in a process fabricating the conductive silicone part 8 and the insulation silicone part 6. That is, at the time of processing a silicone melt mixed with conductive powder, the conductive powder is densely concentrated on the top and bottom surface of a region where the conductive silicone part is to be formed, followed by being subjected to hardening.

Alternatively, after a typical silicone contactor has been fabricated, a high- density conductive reinforcing layer prepared separately may be adhered on the top or/and bottom surface of the conductive silicone part by compression.

Industrial Applicability

According to the present invention, since the inventive pliable conductive

reinforcing layer is formed on the top or bottom surface of the conducive silicone part, it is improved in elasticity and pliability upon the contact between the terminals of the semiconductor device or the pads of the test board and the conductive reinforcing layer, as compared to a separate rigid conductor adhered to an existing silicone contactor. Accordingly, the contacting portion of the conductive reinforcing layer and the terminals of the semiconductor device or the test board are not damaged and its conductivity is improved. Furthermore, foreign substances are prevented from entering the contact surface between the conductive reinforcing layer and the terminals of the semiconductor device or the pads of the test board, thereby lengthening the lifespan of the integrated silicone contactor.

While the present invention has been described with reference to the particular illustrative embodiments, it is not to be restricted by the embodiments but only by the appended claims. It is to be appreciated that those skilled in the art can change or modify the embodiments without departing from the scope and spirit of the present invention.