Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
INTER-BACK TYPE DEPOSITION SYSTEM CAPABLE OF REDUCING FOOTPRINT
Document Type and Number:
WIPO Patent Application WO/2017/111374
Kind Code:
A1
Abstract:
The present invention relates to a deposition system and, more specifically, to a deposition system enabling a substrate to be continuously inputted and discharged when inter-back type deposition is performed by using a plurality of deposition chambers, thereby enabling productivity to be improved by reducing a footprint.

More Like This:
JP5405601Method for manufacturing a flexible circuit board having a bent portion
JP2006286782WIRING BOARD, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
JP2016048788RESIN COMPOSITION
Inventors:
AN KYOUNG JOON (KR)
KIM CHAN HO (KR)
JUNG SUNG HUN (KR)
Application Number:
PCT/KR2016/014566
Publication Date:
June 29, 2017
Filing Date:
December 13, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SNTEK CO LTD (KR)
International Classes:
H05K3/28; C23C14/04; C23C14/14; C23C14/50; C23C16/04; C23C16/06; C23C16/458; H01L21/02; H05K9/00
Foreign References:
KR100852983B12008-08-19
JPH11131232A1999-05-18
KR20150133076A2015-11-27
KR20080086261A2008-09-25
KR20110133690A2011-12-14
Attorney, Agent or Firm:
IAM PATENT & LAW FIRM (KR)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ELECTRONIC DEVICE AND OPERATION METHOD THEREOF

Next Patent: BIDIRECTIONAL OPTICAL TRANSMISSION AND RECEPTION MODULE