Title:
INTER-CIRCUIT-BOARD CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/185935
Kind Code:
A1
Abstract:
The invention comprises: a signal line conductor (22) provided on the surface layer of a printed circuit board (100); a signal line conductor (24) extending from the signal line conductor (22) toward a signal pad (21), and forming with the signal pad (21) a capacitive component therebetween; and a signal line conductor (23) branching and extending from a connecting section between the signal line conductor (22) and the signal line conductor (24), and electrically connected to the signal pad (21).
Inventors:
YUASA TAKESHI (JP)
OSHIMA TAKESHI (JP)
OSHIMA TAKESHI (JP)
Application Number:
PCT/JP2017/014538
Publication Date:
October 11, 2018
Filing Date:
April 07, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H05K1/02; H05K3/36; H05K3/46
Foreign References:
| JP2014093332A | 2014-05-19 | |||
| JP2001217349A | 2001-08-10 | |||
| US20070158797A1 | 2007-07-12 |
Attorney, Agent or Firm:
TAZAWA, Hideaki et al. (JP)
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