Title:
INTERCONNECT FOR MICROELECTRONIC STRUCTURES WITH ENHANCED SPRING CHARACTERISTICS
Document Type and Number:
WIPO Patent Application WO2001048870
Kind Code:
A3
Abstract:
An interconnection element and a method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.
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Inventors:
MATHIEU GAETAN L
ELDRIDGE BENJAMIN N
ELDRIDGE BENJAMIN N
Application Number:
PCT/US2000/035450
Publication Date:
February 21, 2002
Filing Date:
December 27, 2000
Export Citation:
Assignee:
FORMFACTOR INC (US)
International Classes:
H01L21/48; H01L23/48; H01L23/485; H01R12/00; H01R13/24; (IPC1-7): H01L23/485; H01L21/48; H01L23/48
Domestic Patent References:
| WO1998052224A1 | 1998-11-19 |
Foreign References:
| US5848685A | 1998-12-15 | |||
| US5917707A | 1999-06-29 | |||
| US5476211A | 1995-12-19 |
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