Title:
INTERFERENCE EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/210181
Kind Code:
A1
Abstract:
Provided is an interference exposure apparatus capable of monitoring the state of interference fringes in two-beam interference exposure or adjusting the state of interference fringes to a target state. An interference exposure apparatus 100A patterns a workpiece W by using exposure interference fringes. An optical system 120 includes an exposure splitting element 122 that splits coherent light emitted from a laser light source 110 into a first beam and a second beam, and the first beam and the second beam are crossed to irradiate an irradiation area. A combining element 210 can be placed in the irradiation area in a calibration process to combine a left beam BMl and a right beam BMr. An image sensor 220 measures the intensity distribution of the combined beam BMl+r combined by the combining element 210 in the calibration process.
Inventors:
NAWAKI YOHEI (JP)
Application Number:
PCT/JP2023/009215
Publication Date:
November 02, 2023
Filing Date:
March 10, 2023
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
G03F7/20
Domestic Patent References:
| WO2001035168A1 | 2001-05-17 |
Foreign References:
| US20010035991A1 | 2001-11-01 | |||
| CN103698836A | 2014-04-02 | |||
| JP2013145863A | 2013-07-25 | |||
| JPS6398608A | 1988-04-30 |
Attorney, Agent or Firm:
KIMURA Masayoshi (JP)
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