Title:
INTERLAYER FILLING MATERIAL FOR TOUCH PANEL, AND LAMINATED BODY
Document Type and Number:
WIPO Patent Application WO/2015/152334
Kind Code:
A1
Abstract:
The present invention provides an interlayer filling material for a touch panel which is used for filling in between the layers of a touch panel and another member in the manufacture of a portable information terminal or the like, and which conforms well to steps in wiring or steps in a decorative printing part when filling (bonding) is performed, is excellent with respect to the ability to release trapped air bubbles or air bubbles remaining in the vicinity of a step when filling (bonding) is performed, and reduces the scattering of shards when the portable information terminal is damaged. In addition, the objective is to provide a laminated body manufactured using this interlayer filling material for a touch panel. The present invention is an interlayer filling material for a touch panel and is used for filling in between the layers of a touch panel and another member, said interlayer filling material containing plasticized polyvinyl acetal and having a storage modulus (G') (20) of 2×105Pa or greater at 20°C, a storage modulus (G') (85) of 1×106Pa or less at 85°C, and the temperature (Tg) between -20°C and 100°C at which tanδ is the maximum value is 5-85°C.
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Inventors:
FUKATANI JUICHI (JP)
Application Number:
PCT/JP2015/060356
Publication Date:
October 08, 2015
Filing Date:
April 01, 2015
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B32B27/30; G06F3/041; C09J129/14; C09K3/10; G09F9/00
Domestic Patent References:
| WO2013084836A1 | 2013-06-13 |
Foreign References:
| JP2002140014A | 2002-05-17 | |||
| JP2002169017A | 2002-06-14 |
Other References:
See also references of EP 3128398A4
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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