Title:
INTERLAYER INSULATING FILM AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/030544
Kind Code:
A1
Abstract:
An interlayer insulating film for multilayer printed wiring boards, which comprises (A) a wiring line buried layer that is obtained by forming a thermosetting resin composition (I) into a layer and (B) a bonding assistant layer that is obtained by forming a thermosetting resin composition (II) into a layer. This interlayer insulating film for multilayer printed wiring boards is configured such that: 1-10% by mass of a residual solvent is contained in the total mass of the wiring line buried layer (A) and the bonding assistant layer (B); and 10% by mass or more of an organic solvent having a boiling point of 150-230°C is contained in the total mass of the residual solvent.
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Inventors:
MATSUURA MASAHARU (JP)
OGAWA NOBUYUKI (JP)
TAKANEZAWA SHIN (JP)
MIZUNO YASUYUKI (JP)
OGAWA NOBUYUKI (JP)
TAKANEZAWA SHIN (JP)
MIZUNO YASUYUKI (JP)
Application Number:
PCT/JP2017/029267
Publication Date:
February 15, 2018
Filing Date:
August 14, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B32B27/20; H05K1/03; B32B27/34; B32B27/38; H05K3/46
Domestic Patent References:
| WO2015182161A1 | 2015-12-03 |
Foreign References:
| JP2006179888A | 2006-07-06 | |||
| JP2011500948A | 2011-01-06 | |||
| JP2014024961A | 2014-02-06 | |||
| JP2009073987A | 2009-04-09 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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