Title:
INTERLAYER INSULATING RESIN FILM, INTERLAYER INSULATING RESIN FILM HAVING ADHESIVE AUXILIARY LAYER, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2016/129655
Kind Code:
A1
Abstract:
Provided are an interlayer insulating resin film, an interlayer insulating resin film having an adhesive auxiliary layer, and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer, with which it is possible to obtain an interlayer insulating layer having exceptional adhesion to a circuit board even after accelerated environmental testing, and exceptional heat resistance, dielectric characteristics, and low thermal expansion. Specifically: an interlayer insulating resin film containing an epoxy resin (A), a cyanate resin (B), and a dicyandiamide (C); an interlayer insulating resin film having an adhesive auxiliary layer, the adhesive auxiliary layer being provided on one surface of the above-mentioned interlayer insulating resin film, wherein the adhesive auxiliary layer having an adhesive auxiliary layer contains an epoxy resin (a), a cyanate resin (b), and an inorganic filler (c); and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer.
Inventors:
KASAHARA AYA (JP)
MIZUNO YASUYUKI (JP)
MURAI HIKARI (JP)
MIZUNO YASUYUKI (JP)
MURAI HIKARI (JP)
Application Number:
PCT/JP2016/054032
Publication Date:
August 18, 2016
Filing Date:
February 10, 2016
Export Citation:
Assignee:
INTERL CORP (US)
International Classes:
H05K3/46; B32B27/38; C08J5/18; C08L63/00; C08L79/04; C09D7/12; C09J7/22; C09J11/04; C09J163/00; C09J179/04; H05K1/03
Foreign References:
| JP2012045887A | 2012-03-08 | |||
| JP2002179774A | 2002-06-26 | |||
| JPH06329973A | 1994-11-29 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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