Title:
INTERMITTENT ELECTROPLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/245766
Kind Code:
A9
Abstract:
The present invention provides technology for improving the filling properties of micropores in intermittent electroplating. This intermittent electroplating method is for performing intermittent electroplating of a plated object having micropores and includes the use of a plating liquid containing polyvalent metal ions.
Inventors:
IMAI DAIZOU (JP)
SUGIOKA SHUN (JP)
NAGAO TOSHIMITSU (JP)
KATAYAMA JUNICHI (JP)
SUGIOKA SHUN (JP)
NAGAO TOSHIMITSU (JP)
KATAYAMA JUNICHI (JP)
Application Number:
PCT/JP2020/021687
Publication Date:
January 27, 2022
Filing Date:
June 02, 2020
Export Citation:
Assignee:
OKUNO CHEM IND CO (JP)
International Classes:
C25D3/12; C25D3/30; C25D3/38; C25D7/06
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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