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Patent Searching and Data


Title:
INTERNAL MATCHING TYPE HIGH POWER AMPLIFIER
Document Type and Number:
WIPO Patent Application WO/2020/096140
Kind Code:
A1
Abstract:
The present invention relates to an internal matching type high power amplifier, comprising: a heat sink in which a transistor and a plurality of matching circuits connected by wire bonding to form a package are bonded in parallel; an upper substrate disposed on the top of the heat sink, having a bias circuit and a plurality of capacitors mounted thereon, and an embedded section, in which the transistor and the plurality of matching circuits are buried, disposed on the bottom; an RF input stage and an RF output stage which are patterned to be connected to the bias circuit; and a lid which is disposed on the inner surface of the embedded section and protects the transistor and the plurality of matching circuits.

Inventors:
LIM BYEONG OK (KR)
Application Number:
PCT/KR2019/002043
Publication Date:
May 14, 2020
Filing Date:
February 20, 2019
Export Citation:
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Assignee:
LIM BYEONG OK (KR)
International Classes:
H03F1/56; H03F3/60
Foreign References:
KR20150031162A2015-03-23
US5352998A1994-10-04
KR20070013036A2007-01-30
US20160094258A12016-03-31
Other References:
SUGA, RYOSUKE ET AL.: "Cost-Effective 60-GHz Antenna Package With End-Fire Radiation for Wireless File-Transfer System", IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, vol. 58, no. 12, December 2010 (2010-12-01), pages 3989 - 3995, XP011339642, DOI: 10.1109/TMTT.2010.2087032
Attorney, Agent or Firm:
YOON, Hee Sik (KR)
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