Title:
INTERNAL STRUCTURE GRASPING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/082292
Kind Code:
A1
Abstract:
This internal structure grasping system has two kinds of sensors (a geophone sensor terminal (302) and a MEMS sensor terminal (310)) having different operating principles for receiving reflected waves due to vibration given to an inspection target inside an investigation target area, and a processing device for grasping an internal structure of the inspection target by using respective sensor data received by the two kinds of sensors, wherein the two kinds of sensors are distributed at different densities in the investigation target area.
Inventors:
MAEKI AKIRA (JP)
MAZAWA SHIRO (JP)
SAITO TATSUYUKI (JP)
SAKURAI TAKAO (JP)
SEKIGUCHI TOMONORI (JP)
MAZAWA SHIRO (JP)
SAITO TATSUYUKI (JP)
SAKURAI TAKAO (JP)
SEKIGUCHI TOMONORI (JP)
Application Number:
PCT/JP2017/038452
Publication Date:
May 02, 2019
Filing Date:
October 25, 2017
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
G01V1/18; G01V1/20
Domestic Patent References:
| WO2017141304A1 | 2017-08-24 |
Foreign References:
| US20150346365A1 | 2015-12-03 | |||
| US20130021875A1 | 2013-01-24 | |||
| JP2016085085A | 2016-05-19 |
Other References:
MURAKAMI, FUMITOSHI ET AL.: "Evaluation of MEMS Accelerometer Sensor for Earthquake Observations", BULLETIN OF THE EARTHQUAKE RESEARCH INSTITUTE, UNIVERSITY OF TOKYO, vol. 84, 2009, pages 251 - 266, XP055597907
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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