Title:
INTERPOSER DESIGN IN PACKAGE STRUCTURES FOR WIRE BONDING APPLICATIONS
Document Type and Number:
WIPO Patent Application WO/2018/120060
Kind Code:
A1
Abstract:
Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a first die on a board, attaching an interposer on a top surface of the first die, and attaching a second die on the top surface of the first die that is adjacent the interposer, wherein the second die is offset from a center region of the first die. A first wire conductive structure may be attached to the second die that extends from the second die to a top surface of the interposer. A second wire conductive structure is attached to the interposer and extends from the interposer to the board.
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Inventors:
TAN AIPING (CN)
Application Number:
PCT/CN2016/113597
Publication Date:
July 05, 2018
Filing Date:
December 30, 2016
Export Citation:
Assignee:
INTEL CORP (US)
TAN AIPING (CN)
TAN AIPING (CN)
International Classes:
H01L23/495
Foreign References:
| US20120286409A1 | 2012-11-15 | |||
| US20040159929A1 | 2004-08-19 | |||
| CN101378051A | 2009-03-04 | |||
| CN201311930Y | 2009-09-16 | |||
| CN106158818A | 2016-11-23 | |||
| CN204946895U | 2016-01-06 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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