Title:
INTERPOSER AND ELECTRONIC DEVICE USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/013054
Kind Code:
A1
Abstract:
Provided are a novel interposer and a method for manufacturing such interposer. The
interposer (10) is provided with a silicon substrate (12); a plurality of through
hole conductors (20) formed on the silicon substrate; and a capacitor (15) composed
of an upper electrode (14) and a lower electrode (18) formed by extending the land
portions of the through hole conductors, and a dielectric layer (16) formed between
the electrodes. Rewiring layers (23-1, 23-2) are formed as needed on a layer
different from the capacitor.
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Inventors:
KAWANO, Shuichi (2-1, Kanda-cho, Ogaki-sh, Gifu 04, 5038604, JP)
Application Number:
JP2007/063757
Publication Date:
January 31, 2008
Filing Date:
July 10, 2007
Export Citation:
Assignee:
IBIDEN CO., LTD. (2-1 Kanda-cho, Ogaki-shi Gifu, 04, 5038604, JP)
イビデン株式会社 (〒04 岐阜県大垣市神田町２丁目１番地 Gifu, 5038604, JP)
イビデン株式会社 (〒04 岐阜県大垣市神田町２丁目１番地 Gifu, 5038604, JP)
International Classes:
H01L23/32; H01L23/12; H05K3/46
Attorney, Agent or Firm:
TAKAHASHI, Toshihiro (No. 301, Ogikubo Sunny Garden 4-28-9, Ogikub, Suginami-ku Tokyo 51, 1670051, JP)
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