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Patent Searching and Data


Title:
INTERPOSER AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/087753
Kind Code:
A1
Abstract:
This interposer (301) is provided with: a laminate (10) which is obtained by laminating a plurality of insulating substrate layers (11, 12, 13); a first electrode (P1) and a second electrode (P2); conductor patterns (21, 22); and an interlayer connection conductor (V1). The laminate (10) has a first mounting surface (end face (SS1)) on which the first electrode (P1) is formed and a second mounting surface (end face (SS2)) which is on the reverse side of the first mounting surface, and on which the second electrode (P2) is formed. The first electrode (P1) is electrically connected to the second electrode (P2) via the conductor patterns (21, 22) and the interlayer connection conductor (V1). The length (La1) of the electrical path of the plurality of conductor patterns (21, 22) for the connection between the first electrode (P1) and the second electrode (P2) is longer than the total length (Lb1) of the interlayer connection conductor (V1) in the lamination direction.

Inventors:
IIDA KANTO (JP)
KOYAMA HIROMASA (JP)
Application Number:
JP2018/038283
Publication Date:
May 09, 2019
Filing Date:
October 15, 2018
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H01L23/12; H05K1/14
Domestic Patent References:
WO2016088693A12016-06-09
Foreign References:
JP2012186301A2012-09-27
JPH06326475A1994-11-25
JP2009065008A2009-03-26
JP2001077290A2001-03-23
JPH11284342A1999-10-15
JPH0429337A1992-01-31
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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