Title:
CAGE‐SHIELDED INTERPOSER INDUCTANCES
Document Type and Number:
WIPO Patent Application WO/2018/187899
Kind Code:
A1
Abstract:
Disclosed microelectronic assemblies employ an integrated interposer cage to reduce electromagnetic interference with (and from) high‐frequency components. One illustrative embodiment includes: at least one IC die having drive cores for a plurality of oscillators, the IC die attached in a flip‐chip configuration to a (interposer) substrate, the substrate having: multiple inductors electrically coupled to said drive cores and each enclosed within a corresponding conductive cage integrated into the substrate to reduce mutual coupling between the inductors and noise coupled through substrate. An illustrative interposer embodiment includes: upper contacts arranged to electrically connect with micro bumps on at least one IC die; metallization and dielectric layers that form multiple inductors each surrounded by bars of a conductive cage; lower contacts arranged to electrically connect with bumps on a package substrate; and a substrate with a plurality of TSVs (through‐silicon vias) that electrically couple to the lower contacts. Each of the bars includes: at least one of said TSVs, at least one via through the metallization and dielectric layers, and at least one upper contact.
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Inventors:
LIU XIKE (CN)
DAI YIFEI (CN)
DAI YIFEI (CN)
Application Number:
PCT/CN2017/079880
Publication Date:
October 18, 2018
Filing Date:
April 10, 2017
Export Citation:
Assignee:
CREDO TECH GROUP LTD (KY)
International Classes:
H01L23/52; H05K9/00
Foreign References:
| US20070246805A1 | 2007-10-25 | |||
| US20140225706A1 | 2014-08-14 | |||
| CN103179784A | 2013-06-26 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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