Title:
INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER
Document Type and Number:
WIPO Patent Application WO/2012/000685
Kind Code:
A3
Abstract:
Interposer for electrical connection between a CPU chip and a circuit board. A board-shaped base substrate (1) composed of glass has a coefficient of thermal expansion in the range of between 3.1 · 10-6 and 3.4 · 10-6 and holes (12) in a number that is in the range of between 10 and 10,000 cm-2. There are holes (12) having diameters which can be in the range of between 20 μm and 200 μm. Conductor tracks (13) run on one board side, said conductor tracks in each case extending right into the holes (12) and through the latter to the other board side in order to form connection points for the chip.
Inventors:
JACKL OLIVER (DE)
Application Number:
PCT/EP2011/003300
Publication Date:
March 08, 2012
Filing Date:
July 04, 2011
Export Citation:
Assignee:
SCHOTT AG (DE)
JACKL OLIVER (DE)
JACKL OLIVER (DE)
International Classes:
H01L21/48; H01L23/15; H01L23/498
Foreign References:
| US20020180015A1 | 2002-12-05 | |||
| EP1061578A1 | 2000-12-20 |
Other References:
SHAH L ET AL: "Femtosecond laser deep hole drilling of silicate glasses in air", APPLIED SURFACE SCIENCE, vol. 183, no. 3-4, 28 November 2001 (2001-11-28), ELSEVIER NETHERLANDS, pages 151 - 164, XP002659473, ISSN: 0169-4332, DOI: 10.1016/S0169-4332(01)00468-8
KONDO Y ET AL: "Three-dimensional microdrilling of glass by multiphoton process and chemical etching", JAPANESE JOURNAL OF APPLIED PHYSICS, PART 2 (LETTERS) PUBLICATION OFFICE, vol. 38, no. 10A, 1 October 1999 (1999-10-01), JAPAN, pages L1146 - L1148, XP002659474, ISSN: 0021-4922
KONDO Y ET AL: "Three-dimensional microdrilling of glass by multiphoton process and chemical etching", JAPANESE JOURNAL OF APPLIED PHYSICS, PART 2 (LETTERS) PUBLICATION OFFICE, vol. 38, no. 10A, 1 October 1999 (1999-10-01), JAPAN, pages L1146 - L1148, XP002659474, ISSN: 0021-4922
Attorney, Agent or Firm:
HERDEN, Andreas (Alexandrastrasse 5, Wiesbaden, DE)
Download PDF:
Previous Patent: HOLE CREATION WITH MULTIPLE ELECTRODES
Next Patent: METHOD AND DEVICES FOR CREATING A MULTIPLICITY OF HOLES IN WORKPIECES
Next Patent: METHOD AND DEVICES FOR CREATING A MULTIPLICITY OF HOLES IN WORKPIECES