Title:
INTERPOSER PACKAGE AND ELECTRONIC MODULE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2016/137095
Kind Code:
A1
Abstract:
The present invention relates to an interposer package with a bypass capacitor for improving the quality of solder joints with a printed circuit board by reducing the number of power terminals, and an electronic module comprising the same. The interposer package according to one aspect of the present invention comprises: an interposer which includes a first power terminal, formed on one surface thereof, for receiving power from a first electronic device, and a plurality of second power terminals, formed on the other surface thereof, for supplying power to a second electronic device; and a bypass capacitor which is mounted on the interposer, and is connected between one of the plurality of second power terminals and the first power terminal.
Inventors:
KIM CHEOL HO (KR)
Application Number:
PCT/KR2015/013345
Publication Date:
September 01, 2016
Filing Date:
December 08, 2015
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L23/00; H01L23/488
Foreign References:
| JP2007305642A | 2007-11-22 | |||
| KR101222474B1 | 2013-01-15 | |||
| KR20130038969A | 2013-04-19 | |||
| KR20140068690A | 2014-06-09 | |||
| JP2011146517A | 2011-07-28 |
Attorney, Agent or Firm:
JIN, Cheon Woong et al. (KR)
진천웅 (KR)
진천웅 (KR)
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