INTERPOSER STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME

WIPO Patent Application WO/2021/225323

A1

The present disclosure relates to an interposer structure and an electronic device comprising same. The interposer structure, according to one embodiment of the present disclosure, may comprise: an insulation layer comprising at least one through-hole; a first solder resist layer positioned on at least one area on the top surface of the insulation layer, and comprising at least one first opening formed in an area corresponding to the at least one through-hole; a second solder resist layer positioned on at least one area on the bottom surface of the insulation layer, and comprising at least one second opening formed in an area corresponding to the at least one through-hole; at least one conductive via positioned in the at least one through-hole, wherein the at least one conductive via comprises a first protruding portion formed so as to protrude in the direction of the at least one first opening, and a second protruding portion formed so as to protrude in the direction of the at least one second opening; a first presolder disposed on the upper end of the first protruding portion of the at least one conductive via; and a second presolder disposed on the lower end of the second protruding portion of the at least one conductive via.

HA SANGWON (KR)
KIM JICHUL (KR)
PARK JINYONG (KR)
CHUNG YEONKYUNG (KR)

PCT/KR2021/005331

November 11, 2021

April 27, 2021

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SAMSUNG ELECTRONICS CO LTD (KR)

H05K1/11; H05K3/40

KR20140084517A	2014-07-07
JP2005216696A	2005-08-11
KR20200032911A	2020-03-27
KR20160119083A	2016-10-12
US20070045780A1	2007-03-01

See also references of EP 4149217A4

KWON, Hyuk-Rok et al. (KR)

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