Title:
INTERPOSER SUBSTRATE, CIRCUIT MODULE, METHOD FOR MANUFACTURING INTERPOSER CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2018/123414
Kind Code:
A1
Abstract:
An interposer substrate (10), provided with an elementary body (20), external connection conductors (31, 32, 33), and wiring conductors (340, 350). The elementary body (20) has a first main surface (201), a second main surface (202), and a third main surface (203). The distance (D12) between the first main surface (201) and the second main surface (202) is different from the distance (D22) between the first main surface (201) and the third main surface (203). The external connection conductors (31) are formed on the first main surface (201) and connected to an external circuit board. The external connection conductors (32) are formed on the second main surface (202) and connected to a first flat cable. The external connection conductors (33) are formed on the third main surface (203) and connected to a second flat cable. The wiring conductors (340, 350) are formed on the elementary body (20) and connect the external connection conductors (31) with the external connection conductors (32, 33).
More Like This:
JP2003304038 | WIRING BOARD |
JP2005243970 | COMPLEX CIRCUIT BOARD |
JPS5836841 | [Title of the Invention] A manufacturing method of microwave cutlet plastic And |
Inventors:
YAZAKI HIROKAZU (JP)
YONEMORI KEITO (JP)
TSUCHIYA TAKANORI (JP)
KAMADA KOJI (JP)
NOMA TAKASHI (JP)
YONEMORI KEITO (JP)
TSUCHIYA TAKANORI (JP)
KAMADA KOJI (JP)
NOMA TAKASHI (JP)
Application Number:
PCT/JP2017/042938
Publication Date:
July 05, 2018
Filing Date:
November 30, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H01R12/62; H05K1/14; H05K3/36
Foreign References:
JP2015516693A | 2015-06-11 | |||
JP2008258553A | 2008-10-23 | |||
JPH1126631A | 1999-01-29 | |||
JP2005251889A | 2005-09-15 | |||
JP2006245193A | 2006-09-14 | |||
JPH11177239A | 1999-07-02 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
Download PDF: