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Title:
ION MILLING DEVICE AND METHOD FOR ADJUSTING ION SOURCE OF ION MILLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/167165
Kind Code:
A1
Abstract:
Irradiating non-convergent ion beams on a sample increases the machining accuracy of an ion milling device for machining the sample, or increases the reproduction accuracy of the machining surface shape. Therefore, this ion milling device has: a sample chamber 6; an ion source position adjustment mechanism 5 installed in the sample chamber; an ion source 1 that emits ion beams, the ion source being attached to the sample chamber with the ion source position adjustment mechanism interposed therebetween; and a sample stage 2 that rotates about the rotation center. The ion source position adjustment mechanism 5 is capable of adjusting the position of the ion source 1 on an XY plane and the position in a Z direction, where the Z direction is the direction in which the rotation center extends when the ion beam center B0 of the ion beam and the rotation center R0 align, and the XY plane is the plane perpendicular to the Z direction.

Inventors:
KAMOSHIDA HITOSHI (JP)
TAKASU HISAYUKI (JP)
KAMINO ATSUSHI (JP)
IWAYA TORU (JP)
Application Number:
PCT/JP2018/007477
Publication Date:
September 06, 2019
Filing Date:
February 28, 2018
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP (JP)
International Classes:
H01J37/04; H01J37/067; H01J37/20; H01J37/244; H01J37/30
Domestic Patent References:
WO2018003109A12018-01-04
Foreign References:
JPH0329249A1991-02-07
JPH02112138A1990-04-24
JPH10134746A1998-05-22
JP2008204905A2008-09-04
JPS62143351A1987-06-26
JPH0487155U1992-07-29
JPH01142149U1989-09-28
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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