ION MILLING DEVICE, SAMPLE PROCESSING METHOD, PROCESSING DEVICE, AND SAMPLE DRIVE MECHANISM

WIPO Patent Application WO/2011/093316

A1

A technique for processing which does not depend on the material or the angle of incidence of an ion beam is provided. A processing device for processing a sample by directing an ion beam onto the sample, wherein a sample rotating/tilting mechanism for rotating and tilting the sample with respect to the ion beam is provided, the sample rotating/tilting mechanism is provided with a rotation shaft which rotates the sample with respect to the ion beam and is also provided with a tilt shaft which is orthogonal to the rotation shaft and tilts the sample with respect to the ion beam, and rotation and tilting of the sample are performed simultaneously.

NAKAJIMA Rie (1040 Oaza Ichige, Hitachinaka-sh, Ibaraki 33, 〒3120033, JP)
中島　里絵 (〒33 茨城県ひたちなか市大字市毛１０４０番地　株式会社日立ハイテクマニファクチャ＆サービス内 Ibaraki, 〒3120033, JP)
KUROSAWA Koichi (HITACHI HIGH-TECHNOLOGIES CORPORATION 882, Oaza Ichige, Hitachinaka-sh, Ibaraki 04, 〒3128504, JP)

JP2011/051451

August 04, 2011

January 26, 2011

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HITACHI HIGH-TECHNOLOGIES CORPORATION (24-14, Nishi Shimbashi 1-chome Minato-k, Tokyo 17, 〒1058717, JP)
株式会社日立ハイテクノロジーズ (〒17 東京都港区西新橋一丁目２４番１４号 Tokyo, 〒1058717, JP)
NAKAJIMA Rie (1040 Oaza Ichige, Hitachinaka-sh, Ibaraki 33, 〒3120033, JP)
中島　里絵 (〒33 茨城県ひたちなか市大字市毛１０４０番地　株式会社日立ハイテクマニファクチャ＆サービス内 Ibaraki, 〒3120033, JP)

H01J37/30; B23K15/00; G01N1/28; H01J37/20

HIRAKI Yusuke (Kamiya-cho MT Bldg. 19F, 3-20 Toranomon 4-chome, Minato-k, Tokyo 01, 〒1050001, JP)

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