Title:
JACK
Document Type and Number:
WIPO Patent Application WO/2018/216354
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a jack which is configured so that, independent of the distance from the jack to an object to be supported, the jack can be brought in a short time into contact with the object by normal extending and retracting operation without rotating a contact section. This jack (100) is provided with: a base (10) having a sliding shaft (12) and a sliding shaft support section (14); a case (20) mounted to the sliding shaft support section (14) and having a case female thread (22) formed on the inner wall of the case (20); a threaded cylinder (30) engaged with the case female thread (22) by a threaded cylinder male thread (32) formed on the outer wall of the threaded cylinder (30), the threaded cylinder (30) having an operation section (34) and a threaded cylinder female thread (36), the threaded cylinder female thread (36) being formed on the inner wall of the threaded cylinder (30), the inner wall having a center axis aligned with that of the outer wall, the threaded cylinder female thread (36) being cut reversely to the threaded cylinder male thread (32); and a contact section (40) which is engaged with the threaded cylinder female thread (36), has the sliding shaft (12) inserted therein in a non-rotatable state, and is capable of moving along the sliding shaft (12).
Inventors:
HORI MOTOMASA (JP)
YAMAMOTO YASUMASA (JP)
YAMAMOTO YASUMASA (JP)
Application Number:
PCT/JP2018/013658
Publication Date:
November 29, 2018
Filing Date:
March 30, 2018
Export Citation:
Assignee:
KANETEC KK (JP)
International Classes:
B66F3/10; B66F3/08
Foreign References:
JPS328165Y1 | ||||
JP2016169084A | 2016-09-23 | |||
JPS5043482U | 1975-05-01 | |||
JPS51111674U | 1976-09-09 | |||
JP2005180631A | 2005-07-07 | |||
US20170036690A1 | 2017-02-09 | |||
GB243870A | 1925-12-10 | |||
GB270057A | 1927-05-05 | |||
US1379012A | 1921-05-24 | |||
EP0538208A1 | 1993-04-21 |
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
Download PDF: