JET SINGULATION OF A SUBSTRATE - TOWA INTERCON TECHNOLOGY INC

Title:

JET SINGULATION OF A SUBSTRATE

Document Type and Number:

WIPO Patent Application WO2004025724

Kind Code:

A9

Abstract:

Techniques for singulating a substrate (12) into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream (11) in order to cut through large components (12) so as to produce smaller components. The techniques are particularly suitable for singulating surface mount devices such as chip scale packages, ball grid arrays (BGA), flip chips, lead less packages (QFN) and the like. The techniques are also suitable for singulating photonic devices.

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Inventors:

SEO SEILL (US)
JIANG SHAN (US)
TAY STEVEN (US)

Application Number:

PCT/US2003/028743

Publication Date:

May 19, 2005

Filing Date:

September 12, 2003

Export Citation:

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Assignee:

TOWA INTERCON TECHNOLOGY INC (US)
SEO SEILL (US)
JIANG SHAN (US)
TAY STEVEN (US)

International Classes:

B24C5/02; B23Q3/08; B24C1/04; B24C7/00; B24C9/00; B26F3/00; H01L21/00; H01L21/301; H01L21/304; H01L21/48; H01L21/78; H05K3/00; (IPC1-7): H01L21/78; B24C1/04; B24C9/00; H01L21/00; H01L21/304

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