Title:
JET SOLDER BATH
Document Type and Number:
WIPO Patent Application WO/2010/087341
Kind Code:
A1
Abstract:
The height of molten solder which is jetted from the tip of a nozzle is made uniform.
A bath body (2) contains molten solder (20), a pump pressure-feeds the molten solder (20) contained in the bath body (2), a first duct (4) guides the molten solder (20) pressure-fed by the pump in the inflow direction (P1), a direction changing section (9) changes the inflow direction (P1) of the molten solder (20) which is guided by the first duct (4) to the inflow direction (P2), and a second duct (5) guides the molten solder (20) which is changed to the inflow direction (P2) by the direction changing section (9) to a nozzle body (6) in the inflow direction (P3). Since the direction changing section (9) prevents generation of turbulence of the molten solder (20) when the inflow direction (P1) of the molten solder (20) is changed to the inflow direction (P2) by the direction changing section (9), the current velocity and flow rate of the molten solder (20) which is guided from the second duct (5) to the nozzle body (6) are stabilized. As a result, the height of the molten solder (20) which is jetted from a nozzle mouth (3) can be made uniform.
Inventors:
ICHIKAWA Hirokazu (LTD. 23 SENJU-HASHIDO-CHO, ADACHI-K, Tokyo 55, 〒1208555, JP)
市川広一 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
HOSOKAWA Kouichiro (LTD. 23 SENJU-HASHIDO-CHO, ADACHI-K, Tokyo 55, 〒1208555, JP)
市川広一 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
HOSOKAWA Kouichiro (LTD. 23 SENJU-HASHIDO-CHO, ADACHI-K, Tokyo 55, 〒1208555, JP)
Application Number:
JP2010/050981
Publication Date:
August 05, 2010
Filing Date:
January 26, 2010
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO., LTD. (23 SENJU-HASHIDO-CHO, ADACHI-KU Tokyo, 55, 〒1208555, JP)
千住金属工業株式会社 (〒55 東京都足立区千住橋戸町２３番地 Tokyo, 〒1208555, JP)
ICHIKAWA Hirokazu (LTD. 23 SENJU-HASHIDO-CHO, ADACHI-K, Tokyo 55, 〒1208555, JP)
市川広一 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
千住金属工業株式会社 (〒55 東京都足立区千住橋戸町２３番地 Tokyo, 〒1208555, JP)
ICHIKAWA Hirokazu (LTD. 23 SENJU-HASHIDO-CHO, ADACHI-K, Tokyo 55, 〒1208555, JP)
市川広一 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
International Classes:
H05K3/34; B23K1/08; B23K3/06
Attorney, Agent or Firm:
YAMAGUCHI Kunio et al. (Takamura Building 5F, 3-14-7 Yushima, Bunkyo-k, Tokyo 34, 〒1130034, JP)