Title:
JET SOLDERING DEVICE AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/140375
Kind Code:
A1
Abstract:
Provided is a jet soldering device with which it is possible to reduce problems associated with soldering such as bridging and protrusion formation. The disclosed jet soldering device is characterized by having: a solder bath (11) that stores melted solder; a jet nozzle (15) that comprises an end surface from which the melted solder is ejected, a cutout (30) provided in the aforementioned end surface, and a recovery wall (32) provided in the aforementioned end surface; a solder feeding mechanism (13, 20, 21, 22) that feeds the melted solder stored in the solder bath (11) to the jet nozzle (15); a tank driving mechanism (23, 24, 25, 26) that moves the solder bath (11); a solder receiving wall (42) that surrounds the jet nozzle (15) with a prescribed space therebetween and is connected to the jet nozzle (15); and a rotating mechanism (44, 45, 46) that transmits a drive force from the outside of the solder receiving wall (42) and rotates the solder receiving wall (42) and the adhesion nozzle (15).
Inventors:
MIMURA, Toshinori (())
三村敏則 (())
YAMAUCHI, Hiroshi (())
三村敏則 (())
YAMAUCHI, Hiroshi (())
Application Number:
JP2010/003728
Publication Date:
December 09, 2010
Filing Date:
June 04, 2010
Export Citation:
Assignee:
PANASONIC CORPORATION (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
MIMURA, Toshinori (())
三村敏則 (())
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
MIMURA, Toshinori (())
三村敏則 (())
International Classes:
H05K3/34; B23K1/00; B23K1/08; B23K101/42
Attorney, Agent or Firm:
HARADA, Yohei (OX Nishihonmachi Bldg. 4th Floor, 10-10 Nishi-Hommachi 1-chome, Nishi-ku, Osaka-sh, Osaka 05, 〒5500005, JP)
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